Application
Application
Automotive
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Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
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New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 04, 2026
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Embedded Editor: CES 2026 Trends Roundup
January 19, 2026
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SOAFEE Blueprint: Enabling AI-Native, Offline-Resilient Vehicle Software with mimik
January 15, 2026
IoT
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Choosing the Right Silicon for Edge AI: How Intel, AMD, NVIDIA, and Arm Are Shaping the Next Generation of Distributed Computing
February 17, 2026
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Industry Acquisitions, Connectivity, IoT, AI, and Embedded Trends For 2026
February 12, 2026
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The Road to embedded world: Discover Vecow’s AI PC Revolution and Robotics Supercomputers
February 12, 2026
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Virscient to Present Cutting-Edge Wireless Connectivity and Audio Technologies at embedded world Germany
February 11, 2026
Processing
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Sundance Will Showcase Thermal-Efficient Efinix Titanium Ti135 FPGA Module at embedded world’ 26, Germany
February 18, 2026
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Solectrix to Introduce its proFRAME Base Board 3.1 PXIe Targeting Aerospace, Automotive, and Railway Test Applications at embedded world Germany
February 18, 2026
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The Road to embedded world: Enclustra Highlights Andromeda RFSoC, AMD Versal SoC, and Edge AI Solutions
February 10, 2026
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Semiconductor M&A Heats Up Early in 2026: More to Come?
February 04, 2026
Security
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STM32 OTA Firmware Update
February 04, 2026
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Embedded Executive: The Latest On the Chips Act | PQSecure
February 04, 2026
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PX5 NET Gains TÜV Approval, Enabling Faster Certification of Safety-Critical Embedded Applications
January 22, 2026
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New RunSafe Security Report: Engineering Leaders Brace for Rising Cyber Risks in Embedded AI
December 11, 2025