Application
Application
Automotive
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Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
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New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 04, 2026
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Embedded Editor: CES 2026 Trends Roundup
January 19, 2026
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SOAFEE Blueprint: Enabling AI-Native, Offline-Resilient Vehicle Software with mimik
January 15, 2026
IoT
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Choosing the Right Silicon for Edge AI: How Intel, AMD, NVIDIA, and Arm Are Shaping the Next Generation of Distributed Computing
February 17, 2026
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Industry Acquisitions, Connectivity, IoT, AI, and Embedded Trends For 2026
February 12, 2026
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The Road to embedded world: Discover Vecow’s AI PC Revolution and Robotics Supercomputers
February 12, 2026
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Virscient to Present Cutting-Edge Wireless Connectivity and Audio Technologies at embedded world Germany
February 11, 2026
Storage
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The Road to embedded world: BIWIN Highlights TAU208 UFS 3.1 Automotive Storage
February 13, 2026
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MEMPHIS Electronic Showcases Long-Term Memory Availability Planning at embedded world Germany
February 11, 2026
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Intelligent Memory Showcases Industrial SD and microSD Storage Solutions at embedded world Germany 2026
February 10, 2026
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Product of the Week: ATP’s 6.7 mm e.MMC for Next-Gen Smart Wearables
February 02, 2026
Security
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STM32 OTA Firmware Update
February 04, 2026
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Embedded Executive: The Latest On the Chips Act | PQSecure
February 04, 2026
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PX5 NET Gains TÜV Approval, Enabling Faster Certification of Safety-Critical Embedded Applications
January 22, 2026
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New RunSafe Security Report: Engineering Leaders Brace for Rising Cyber Risks in Embedded AI
December 11, 2025