Renesas Opens Physical AI and Robotics Lab in Beijing
August 28, 2026
News
Renesas Electronics Corporation has officially opened its Physical AI and Robotics Lab in Beijing, China. The lab will facilitate users in demonstrating, validating, and collaborating in the design of next-generation robotic systems. The lab will serve as a center for fulfilling Renesas’ physical AI strategy from proof-of-concept to deployment at scale.
“China continues to lead in robotics innovation and adoption with a deep customer base, a highly collaborative ecosystem and a comprehensive supply chain service system,” said Yvonne Liu, Vice President and President of Renesas China. “Renesas will leverage its Physical AI Lab in Beijing and its technology capabilities to collaborate closely with customers, ecosystem partners, universities and startups. As part of Renesas’ key strategy in China, this lab will accelerate the engineering implementation of physical AI systems.”
To support the full engineering process from development to deployment, the lab will integrate hardware, software, AI modeling, control, power supply, sensing, and system-level verification. The facility is expected to connect customer needs, ecosystem resources, and advanced technologies for complete robotics solutions.
“Humanoid robots are becoming more sophisticated and complex, driving demand for hardware and software systems that must work together seamlessly,” said Ivo Marocco, Vice President and Head of UX at Renesas. “Today, Renesas can address roughly 30 percent of the humanoid robot BOM, and we see an opportunity to expand that coverage to 70 percent through our strengths in control, power, sensing, AI, software and ecosystem solutions. Our new lab will help customers validate complete systems and accelerate the deployment of next-generation robotics innovations.”
For more information, visit renesas.com.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
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Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
