Smith to Help Navigate Increasingly Complex Market Conditions at embedded world NA
September 11, 2026
News
Smith will be in Exhibit Hall B, Booth 6426 during embedded world North America 2026 where its onsite experts will have availability to discuss Smith's approach to navigating complex market conditions and procuring critical components for its customers. The company’s customizable and comprehensive solutions will be demonstrated along with its Intelligent Distribution model and its extensive global reach.
"Procurement professionals are under strain with the current market conditions, limiting their ability to fully maximize opportunities in the AI revolution," said Todd Burke, Chief Commercial Officer at Smith. "With more than four decades of industry experience and deep market knowledge, our team of experts has the connections and skills to secure the chips our customers need to continue building the next generation of cutting-edge technologies."
The exhibition will take place from Tuesday, September 22, through Thursday, September 24, in Anaheim, California and marks Smith's second time attending the show.
For more information, visit smithweb.com/.
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