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Friday 1/10

 

Bridgetek has introduced the PanL70, PanL70Plus, and PanL50 display units, associated with its recently launched PanL building automation platform. Providing elevated performance and optimal feature sets, they are able to cover a diverse array of prospective use cases.

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D3 Engineering has released the DesignCore RVP-TDA4Vx Development Kit, a rugged vision ECU platform based on Texas Instruments? TDA4VM SoC with an integrated image signal processor (ISP) and a configurable SerDes interface.
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Newark, distributor of technology products, services and solutions for electronic system design, maintenance and repair, has expanded its linecard with an increased range of XP Power products.
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Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced the ISL78083, an integrated power management IC (PMIC) that simplifies power supply design for use in multiple HD camera modules.
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Scheduled for the first half of 2020, there is still some time to go before the final PICMG ratification of the COM-HPC specification. Nonetheless, the PICMG subcommittee already approved two key aspects in November 2019: the physical footprints and the pinout.

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