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Wednesday 3/18

 

The AC transimpedance amplifier discussion, in my previous blog, TIA Fundamentals: The Parasitics Part 3, provides an understanding of the circuit?s noise gain and stability. In Part 4, we?ll dive into the derivation of the noise gain transfer function.

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ACM Research introduced its Ultra SFP ap tool for advanced packaging solutions. The tool was designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP).
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u-blox announced its SARA-R410M-63B module has been certified for Japan market on the LTE-M cellular network of the domestic network operators.
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Semtech released its new LoRa-based platform, LoRa Edge, for the development of Internet of Things (IoT) applications.
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Inferencing is a hot topic. Let?s start with ?what is inferencing?? Then, how do you benchmark inferencing? That?s the topic du jour in this week?s Embedded Executives podcast, with guest Geoff Tate is CEO and co-founder of Flex Logic. We also get into whether some vendors are trying to rig the system.

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Geoff Tate
 

 
 
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