EmbeddedDaily
 

Wednesday 6/17

 

There are several reasons a thermoelectric cooler module might suffer an operational failure. The most common failure mechanism is a fracturing of the semiconductor pellets or the connecting solder joints. In addition to thermally and mechanically related issues, the presence of external contaminants can also pose a threat to TEC operation.


Every solution to these challenges has its advantages and disadvantages, therefore tradeoffs have to be made.

Read more

 
TEC assembly
 

QuickLogic Corporation announced its QuickLogic Open Reconfigurable Computing (QORC) initiative. According to the company, this makes QuickLogic the first programmable logic vendor to actively embrace a fully open source suite of development tools for its FPGA devices and eFPGA technology.
Read more

 

The RFP kit, which is based on a COM Express Type 6 module, features three virtual machines built on real-time systems? hypervisor technology in vision applications.
Read more

 

Infineon announced the addition of Semper Secure to its Semper NOR Flash memory platform. According to the company, Semper Secure NOR Flash the first memory solution to combine security and functional safety in a single NOR flash device.
Read more

 

The LoRa Alliance is a fairly dynamic organization, as projects appear to be progressing nicely. The organization began with just a handful of vendors and has now grown to more than 500. To that end, Dave Kjendal, CTO and Executive Vice President of Engineering at Senet, has just joined the Alliance?s Board of Directors. It seemed like a good time to speak to Dave to hear what his ideas and direction are for the Alliance. Dave is my guest on this week?s Embedded Executives podcast.

Tune In

 
Dave Kjendal
 

 
 
Share
Facebook
 
LinkedIn
 
Twitter
 
 

View the latest
Embedded Products  |  Embedded News