EmbeddedDaily
 

Monday 6/22

 

Intermolecular, a wholly-owned subsidiary of Germany-based Merck KGaA, recently announced an atomic layer deposition (ALD) GeAsSeTe (Germanium, Arsenic, Selenium, Tellurium) ovonic threshold switch (OTS) for 3D vertical memory arrays. The company claims that it?s the first of its kind.

Read More

 
Vjayblog1pic.jpg
 
X-ES
 

Advantech and Mocana announced a partnership in which the companies are bringing Mocana?s end-to-end protection capabilities to Advantech?s IoT gateway devices.
Read more

 

IBASE Technology releases its newest EC-3200 AI computing platform, based on the NVIDIA Jetson Tegra X2 (TX2) processor.
Read more

 

TE Connectivity announced it has added Extra Rugged Circular connectors (XRC), Sealed Rectangular Connectors (SRC), ML-XT connectors, and XRC terminals to its portfolio of connectivity solutions.
Read more

 

If you have plans to design in a Qualcomm 9205 LTE modem, you may want to take notice of Winbond Electronics? latest flash memory device, the QspiNAND. It?s the company?s first 1.8V, 512-Mbits part, which hits the sweet spot for cellular NB-IoT module designers, serving automotive and IoT. Current draw is 25 mA active, 10 ?A standby, and 1 ?A in deep power-down mode.

Read more

 
Screen Shot 2020-06-22 at 10.41.22 AM.png
 

 
 
Share
Facebook
 
LinkedIn
 
Twitter
 
 

View the latest
Embedded Products  |  Embedded News