Monday 6/22


Intermolecular, a wholly-owned subsidiary of Germany-based Merck KGaA, recently announced an atomic layer deposition (ALD) GeAsSeTe (Germanium, Arsenic, Selenium, Tellurium) ovonic threshold switch (OTS) for 3D vertical memory arrays. The company claims that it?s the first of its kind.

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Advantech and Mocana announced a partnership in which the companies are bringing Mocana?s end-to-end protection capabilities to Advantech?s IoT gateway devices.
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IBASE Technology releases its newest EC-3200 AI computing platform, based on the NVIDIA Jetson Tegra X2 (TX2) processor.
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TE Connectivity announced it has added Extra Rugged Circular connectors (XRC), Sealed Rectangular Connectors (SRC), ML-XT connectors, and XRC terminals to its portfolio of connectivity solutions.
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If you have plans to design in a Qualcomm 9205 LTE modem, you may want to take notice of Winbond Electronics? latest flash memory device, the QspiNAND. It?s the company?s first 1.8V, 512-Mbits part, which hits the sweet spot for cellular NB-IoT module designers, serving automotive and IoT. Current draw is 25 mA active, 10 ?A standby, and 1 ?A in deep power-down mode.

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