Wednesday 11/11


In part 2 of the Embedded Insiders? analysis of recent industry acquisitions, Stacey Higginbotham, a tech industry expert and editor of the eponymous Stacey on IoT blog, joins Brandon and Rich to further the discussion about the ARM/NVIDIA deal. Wait. What did NVIDIA buy? Or better yet, what didn?t they buy? Why didn?t they acquire the entire Arm portfolio? And where is the rest of it now?

After, Jim McGregor of Tirias Research returns to analyze AMD?s acquisition of programmable logic supplier Xilinx.

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Silicon Labs has expanded its portfolio of pre-certified wireless modules for IoT application development. The expansion is compiled of four new modules including the xGM210PB, BGM220, MGM220, and BGX220 Xpress.
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According to a new report from Semico, titled, ?Analog Market Update: Making Digital Systems Come Alive (MP115-20),? the global electronics market is expected to consume 160 billion Analog ICs in 2020.
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Samsung Electronics, in collaboration with design services provider, VeriSilicon, has supported the on-time market launch of AI Edge computing startup Blaize?s hardware platform.
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According to analysts, IP theft costs industry a staggering $500 to $600 billion per year. With more than half a trillion dollars at stake, you?d think that IP protection would be top of mind for many electronic device manufacturers.
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Higher voltages and higher frequencies are becoming commonplace in embedded designs. That in itself doesn?t necessarily cause an issue. But, when you add in that packages continue to shrink in size, you have the potential for detrimental heat and airflow issues. How do you deal with that? That?s where the discussion started with Dr. Phil Lessner, the Senior Vice President and Chief Technology Officer, at KEMET. He had lots of advice for system designers in this week?s Embedded Executives podcast.

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Phil Lessner


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