Embedded Computing Design

Connectivity for embedded and IoT products is evolving, moving away from solutions that leverage a single capability, but instead to robust combinations designed to address multiple needs and use cases across industrial, medical, automation, smart devices, and more.

Developments in artificial intelligence are rapidly enhancing what humanoid robots can perceive, understand and accomplish. While current lab and prototype demonstrations are impressive, developing these platforms into commercially viable products will require highly optimized hardware platforms. What’s needed are new system architectures capable of connecting a myriad of cameras, sensors, actuators, storage and processors while at the same time meeting stringent requirements for power, weight, latency, cost and reliability.

On this episode of SystemChat, we hear from our guest Brad Rex, head of Physical AI & Humanoid Robotics at Renesas, and we discuss systems of Physical AI. On this episode of SystemChat, we hear from our guest Brad Rex, head of Physical AI & Humanoid Robotics at Renesas, and we discuss systems of Physical AI. On this episode of SystemChat, we hear from our guest Brad Rex, head of Physical AI & Humanoid Robotics at Renesas, and we discuss systems of Physical AI.

AUSTIN, Texas, Oct. 7, 2026 -- Silicon Labs announced developer initiatives designed to simplify building, extending, and operating capable IoT devices. Unveiled at the company's seventh annual Works With Summit, the new offerings expand what developers and their AI agents can create on the Silicon Labs platform while helping customers develop, deploy, and manage edge intelligence.

Attendees to electronica 2026 in Munich, Germany, from 10–13 November, will have a chance to see Taoglas when visiting Hall C2, Booth 516. The company will demonstrate its innovations in RF, antenna, and wireless connectivity technologies. The exhibited technologies will show how Taoglas aids engineers in accelerating development, enhancing wireless performance, and reducing integration risk.

Syslogic announced the Railway Computer RML 83 based on the SMARC standard and Intel Atom Amston Lake processors, available with either the Intel Atom x7433RE quad-core processor or the x7835RE octa-core processor. The solution is certified EN 50155 and combines energy-efficiency with flexibility for custom hardware adaptations.    

CML Micro launched a compact power amplifier for next-generation ISM-band radio designs, its CMX90A002. The device is designed for the development of sub-GHz wireless products and combines power-supply flexibility with a 3×3mm footprint, streamlining component selection and integration across a wide range of architectures. The solution will be demonstrated at European Microwave Week (EuMW) 2026 at Stand B30A.

Anaheim, CA, September 22, 2026. Embedded Computing Design (a division of OpenSystems Media), the leading source of “how-to” technical articles, videos, blogs, conferences, and podcasts for embedded engineers, today announced that STMicroelectronics has been named a winner of the embedded world North America Best in Show Award. All entries are assessed by the Editorial Team based on Design Excellence, Relative Performance and Market Impact.

MEMPHIS Electronic announced it has signed a distribution agreement with Puya Semiconductor bringing Puya’s NOR Flash and EEPROM product families to MEMPHIS Electronic's global customers.

Wherever you look in industrial control and embedded systems, you will find surging demand for more powerful computing. Artificial intelligence (AI) and smarter algorithms for signal processing are creating new applications and boosting the effectiveness of a vast range of electronic systems, from sensor hubs for the Internet of Things (IoT) to industrial robots.