Embedded Computing Design

DigiKey has added around 31,000 new products available to ship the first quarter of 2026. Breaking down the numbers, the company states that over 387,000 new products were added to the DigiKey system, along with 97 new suppliers.

Taipei, Taiwan (March 11, 2026) – ASRock Industrial is honored to receive the Best in Show Award at Embedded World 2026, presented by Embedded Computing Design, for its iEP-5010G-DCN Industrial Controller. The Best in Show Awards recognize the most innovative technologies showcased at Embedded World, highlighting solutions that deliver significant advancements in design excellence, outstanding performance, and significant market impact in the fields of embedded and industrial computing.

CES 2026 will welcome Dr. Lisa Su, Chair and CEO of AMD, as a keynote speaker. Taking place Monday, January 5^th at 6:30p.m., Dr. Su’s address will focus on AMD’s vision for delivering future AI solutions from cloud to enterprise, edge and devices.

xMEMS Labs released the xMEMS XMC-2400 µCooling chip, billed as the first-ever all-silicon, active micro-cooling fan designed for ultramobile devices and innovative artificial intelligence (AI) solutions.

Santa Clara, California. FMS: the Future of Memory and Storage has announced it will be featuring 11 keynote presentations. “Keynote addresses are a traditional FMS highlight. This year’s FMS will be no exception,” said Jay Kramer, FMS keynote Master of Ceremonies. “Attendees will hear about the latest memory and storage technology advances empowering emerging applications driven by AI, big data analytics, quantum computing and 5G infrastructure.”

Santa Clara, California. Nominations are now being accepted for Best of Show Awards at FMS: the Future of Memory and Storage, marking its 18th year. Celebrated as a premier international forum for highlighting advancements, trends, and key players in the high-speed memory and storage technology sectors, FMS is set for August 6-8 at the Santa Clara Convention Center.

India. Logic Fruit Technologies has earned the prestige of Premier Partner with AMD Xilinx by providing industries with inventive programmable logic devices. For the recognition, Logic Fruit had to exemplify its promise to continue the drive for the most innovative customized environments for industrial, defense, automotive, and consumer electronics applications.

Little Free Libraries have been popping up in neighborhoods worldwide: small, mailbox-style containers offering free books that are populated by local communities. These micro-libraries are often maintained by volunteers and help foster a love of reading by providing easy access to books for people of all ages. They also spark creativity and build community by promoting neighborhood book exchanges. Anyone can take or leave a book from the library 24/7.

GEODE is Diamond’s newest and most innovative and feature-packed rugged computer system. It features COM Express architecture for performance scalability, earlier access to latest generation CPU technology, as well as longer product lifetime. The board-to-board internal construction eliminates most internal cabling to facilitate quicker delivery of custom configurations by elimination of custom case and cabling design and manufacturing. I/O expansion is easy with off the shelf PCIe/104 x1 and x16 I/O modules as well as dual PCIe minicard sockets and M.2 mass storage. IP67 construction and MIL-STD-810 shock/vibration compliance make Geode a perfect fit for the most rugged vehicle applications. Geode integrates a MIL-STD-461/704/1275 compliant power supply with isolation to meet military requirements. Standard configuration includes 11th Gen Core i7 with 64GB RAM, dual Gbe, HDMI, USB3, RS-232/422/485, and GPIO. 

In 2022, Exascend’s Industrial-grade PCIe E1.S SSD was the embedded world winner of the Most Innovative Industrial Storage Products. At embedded world 2023, located in hall 1 booth 420, Exascend will belaunching its extremely high-storage-density M.2 and U.2 SSDs. Products highlighted in Exascend’s booth will feature next-level sustainable performance, high reliability, low power, and impenetrable security.