Register Now for Early Access to SECO’s SOM-SMARC-Dragonwing-IQ8 Hardware
August 28, 2026
News
SECO announced early sample access for a limited quantity of its SOM-SMARC-Dragonwing-IQ8 hardware allowing the evaluation of the SMARC Rel. 2.1.1 module based on Dragonwing IQ8 Series. The module was engineered as part of the collaboration between SECO, Arduino, and Qualcomm Technologies, Inc. It enables users to move from rapid prototyping to production-oriented architectures for AI-enabled robotics, smart machines, industrial vision, HMI, and machine control.
“The transition from prototype to production is where many Edge AI projects lose momentum,” said Lorenzo Veltroni, Chief Product and Marketing Officer at SECO. “With SOM-SMARC-Dragonwing-IQ8, we are helping OEMs bridge that gap, enabling a seamless path from rapid prototyping with Arduino VENTUNO Q to industrial-scale deployment. By combining the performance of Dragonwing technology with SECO’s expertise in industrial platforms, the SOM-SMARC-Dragonwing-IQ8 empowers customers to accelerate innovation while ensuring reliability, lifecycle support, and long-term availability.”
Support for transitioning from rapid prototyping is made possible via Arduino VENTUNO Q, Arduino’s Edge AI development platform based on Dragonwing IQ8 Series, to industrial-scale deployment. Applications can be built and validated on Arduino VENTUNO Q and use Arduino App Lab to port them to SECO’s Dragonwing IQ8-based system-on-module.
According to the press release, SECO complements this software continuity with industrial-grade SMARC hardware, carrier board design expertise, BSP and OS support, cybersecurity services, long-term lifecycle management, and out-of-the-box support for the Clea framework. Clea extends the hardware capabilities with fleet management, secure remote OTA updates, remote troubleshooting, container orchestration and accelerated AI workflow deployment at scale via Clea Studio AI, for long-term scalability, all within the Works with ArduinoTM ecosystem.
Highlights:
- AI acceleration options up to 40 TOPS configurations
- Compact modular architecture based on the SMARC Rel. 2.1.1 standard
- Up to 32GB LPDDR5 / LPDDR5X memory and up to 1TB UFS 3.1 storage
- Connectivity and expansion options include Gigabit and 2.5 Gigabit Ethernet, PCIe Gen4, MIPI-CSI, and CAN-FD
- Clea OS support provides a consistent software baseline for secure lifecycle management, OTA updates, and connected device scalability
Register here to receive updates on priority access, evaluation opportunities, and technical resources.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
