The Evolution of Higher Speed and Density in Rugged Electronic Packaging
On-demand webcast:
Aired live: June 12, 2019 11:00 AM EDT
Copper and optical interconnect technologies play a significant role in next generation rugged embedded computing, with the drive toward higher speeds and smaller form factors. Join our panel of industry-recognized experts on June 12 at 11AM EDT who will discuss the levels of electronic packaging – from chips to external cabling, how copper interconnect solutions are evolving, and where optics technology breaks through to address emerging needs.
Speakers: Mark C. Benton, MS/PhD ME (RFO Engineering Manager/Active Products Business Development Manager), TE Connectivity
Michael Walmsley, Global Product Management – Connectors, Aerospace, Defense & Marine (AD&M), TE Connectivity
Matthew R. McAlonis, Engineering Fellow – Certified LDFSS Black Belt, Aerospace, Defense & Marine (AD&M), TE Connectivity
Moderator: John McHale, OpenSystems Media
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