Processing
Tria Technologies Unveils COM-HPC Computer-on-Module Powered by Intel Core Ultra Processors with 180 TOPS AI Performance
April 17, 2026
Tria Technologies launched the COM-HPC Client Computer-on-Module (CoM) leveraging the Intel Core Ultra Processors (Series 3). The module features an integrated AI accelerator (NPU) as well as Intel Xe graphics with up to 12 Xe cores, promoting up to 180 trillion operations per second (TOPS).
Security
Digi DAL OS Solutions Gain FIPS 140-3 Validation for Government and Regulated Industries
April 16, 2026
Digi International publicized an advancement in device security with the validation of FIPS 140-3 cryptographic modules across its portfolio of solutions based on the Digi Accelerated Linux (DAL) operating system including Digi EX, IX and TX Cellular Routers, Digi Connect IT Console Servers, Digi Connect EZ Serial Device and Terminal Servers, and Digi AnywhereUSB USB Over IP. According to the press release, Digi is the first provider of cellular connectivity solutions to achieve FIPS 140-3 validation without specialized SKUs.
Multimedia
embedded world 2026 Podcast with onsemi
April 16, 2026
When the discussion of “AI everywhere” comes up with the folks at onsemi, they know that there’s far more to the design complexity than massive amounts of processing. They help designers deal with the massive amount of power that’s required to drive these systems. Embedded Computing Design’s Rich Nass sat with onsemi’s Felicity Carson to understand how the company is working with designers to maximize power efficiency.
Analog & Power
-
Embedded Executive: embedded world recap | DigiKey
April 08, 2026
-
Timing Is Now a Platform Decision: Why the Clock Must Come First
April 03, 2026
-
embedded world 2026 Podcast with Lattice Semiconductor
March 31, 2026
-
Timing Takes Center Stage: What Engineers Told Us About the Future of Electronic Design
March 19, 2026
AI & Machine Learning
-
Embedded AI Isn’t Enterprise AI, and That’s a Good Thing
April 13, 2026
-
Scale-Up & Scale Out: Addressing the Demands of Modern AI Networks
April 09, 2026
-
embedded world 2026 Podcast with Axelera AI
March 25, 2026
-
Kontron KBox A‑151 EAI Now Powered by SiMa.ai Physical AI for Industrial Edge
March 20, 2026
Automotive
-
eSOL and Quintauris Partner to Expand Software Integration in RISC-V Automotive Platforms
March 23, 2026
-
How BASE-AU Enables High-Speed Optical Camera Links in Next-Generation Vehicles
March 05, 2026
-
From Design to Verification: Best Practices for Automotive Functional Safety Certification
February 05, 2026
-
Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
Consumer
-
Create reliable, power efficient and safe home appliance designs with a PSOC™ Control C3 and CoolGaN™ solution
February 18, 2026
-
Tear Down: Google Pixel Watch 4
February 03, 2026
-
TDK Adds SmartMotion for Smart Glasses to its Custom Sensing Solutions for AI Glasses and Augmented Reality
September 30, 2025
-
Arm Delivers Personal AI on Consumer Devices with New Lumex CSS Platform
September 10, 2025
Healthcare
-
Wincomm’s New Medical All-in-One PCs Feature IP65 Front Panel, Built-In Power Supply, and “Clean Me” Mode
February 24, 2026
-
Empowering Real-Time Eye Health Diagnostics with ASUS IoT PE4000G Edge AI Computers
February 23, 2026
-
Axiomtek’s mBOX603 Delivers High-Performance Medical Imaging and AI-Assisted Diagnostics
December 10, 2025
-
Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
Security
-
Microchip Secures IEC 62443-4-1 ML2 Certification, Strengthening Industrial Cybersecurity
April 10, 2026
-
Axelera AI Integrates Kudelski Secure Enclave into Europa Edge AI Platform
March 27, 2026
-
The EU Cyber Resilience Act & Industrial Power Conversion in Data Centers
March 26, 2026
-
Embedded Executive: Once Again, You MUST Implement Security | Thistle Technologies
March 18, 2026
Software & OS
-
Aptiv Highlights VxWorks Role in Artemis II Safe Astronaut Return
April 13, 2026
-
Collabora Launches Apertis v2026 Based on Debian 13 (Trixie)
April 07, 2026
-
embedded world 2026 Podcast with QNX
April 02, 2026
-
Renesas Press Conference at embedded world 2026
March 31, 2026
HPC/Datacenters
-
PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
-
BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
-
Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
-
Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025