New Ultra C VI System Leverages ACM?s Proven Multi-Chamber Technology, Delivering High Throughput and Low Cost of Ownership for Memory Manufacturers.

ACM Research, a supplier of wafer-processing solutions, announced the release of three Ultra C wet cleaning tools for both front and backside processes.

The Ultra Furnace system is intended for batch processing of up to 100 12-inch (300mm) wafers.

ACM introduced its Ultra SFP ap tool for advanced packaging solutions. The tool was designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging.