ACM Research, a supplier of wafer-processing solutions, announced the release of three Ultra C wet cleaning tools for both front and backside processes.

The Ultra C b for backside clean, Ultra C wb automated wet bench, and Ultra C s scrubber expand the organization’s technology into broader applications. The purpose of the three tools is to target IC, power devices, and advanced WLP markets.

The Ultra C b is a backside cleaning tool was developed for particle performance and etch uniformity control. Additionally, it has features ideal for the mitigation of high warpage, suited especially for processing 200mm or 300mm ultra-thin wafers and bonding wafers.

 Ultra C wb can perform batch cleaning up to 50 wafers. It utilizes the same wet bench technology developed for ACM’s Ultra C Tahoe hybrid bench and single-wafer cleaning tool, according to the company.

The s scrubber uses the organizations scrubber capabilities for WLP and advances them to the IC processing in the foundry. Per information provided by the company, its soft brush uses precise pressure control to remove particles following wafer frontside, bevel and backside cleans of wafers.