AI & Machine Learning
2026 embedded world: “Build Once, Scale Anywhere” Keynote by Microchip COO, Rich Simoncic
March 19, 2026
There were many themes and trends discussed at the 2026 embedded world exhibition and conference in Nuremberg, Germany this year. Those being energy-efficiency and sustainability, security regulations like the Cyber Resilience Act (CRA), and, of course, one that will likely continue to be a topic for years to come and for many embedded computing companies, artificial intelligence (AI).
Analog & Power
Timing Takes Center Stage: What Engineers Told Us About the Future of Electronic Design
March 19, 2026
In the fast-paced world of electronic design, engineers often focus on processing, power consumption, connectivity, and performance as the key levers of innovation. But in 2025, something fundamental is shifting in the design process — and engineers are taking notice.
Debug & Test
The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems
March 16, 2026
TASKING attended embedded world Germany where it showcased solutions that connect the full embedded software lifecycle from compile to debug and test through one integrated workflow ideal for automotive, aerospace and defense, industrial, and robotics applications.
AI & Machine Learning
The Role of Motor Control in Physical AI
March 16, 2026
Physical AI is a term that’s in vogue right now. It refers to the application of AI to systems that directly interact with and influence the physical world. Unlike Cloud-based AI models that analyze data and produce insights, physical AI closes the loop between perception, decision-making, and actuation. It senses its environment, processes that data locally or at the Edge, and then potentially drives such equipment as motors, valves, pumps, or actuators. In short, it turns algorithms into action.
Industrial
The Road from embedded world: APLEX Demonstrates ATEX Explosion-Proof Panel PCs, Displays, and AVoIP Technology
March 16, 2026
APLEX Technology Inc. thanks everyone who visited and supported it during embedded world Germany. During the show APLEX demonstrated its new ATEX explosion-proof solutions, including panel PCs, displays, and AVoIP (Audio and Video Over Internet Protocol) box.
Uncategorized
embedded world Germany 2026 Best-in-Show: Honorable Mention
March 11, 2026
All entries are judged using a 15-point rubric that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.
Uncategorized
embedded world Germany 2026 Best-in-Show: Winners
March 11, 2026
All entries are judged using a 15-point rubric that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.
IoT
The Road to embedded world: Ambarella Debuts Edge AI Innovations and Developer Tools
March 9, 2026
Join Ambarella at Hall 5, Booth 5-355 during embedded world Germany where it will exhibit its AI SoCs, software stack, and developer tools that help teams build, integrate, and deploy edge AI solutions at scale. The booth is centered on the theme “The Ambarella Edge: From Agentic to Physical AI” and will have live demos highlighting innovations that offer a competitive advantage across various AI applications, from agentic automation and orchestration to physical AI systems operating in real-world environments.
Industrial
embedded world 2026 Product Showcase: WIZnet WIZ-IP20 ioPort
March 9, 2026
Most of today’s industrial and embedded applications require the advanced, versatile, and reliable networking capabilities needed by communication devices. Legacy serial devices often lack in this area and require solutions that can speak to modern devices.
Processing
embedded world Product Showcase: Ambient Scientific’s GPX10 Pro
March 9, 2026
Battery-powered edge AI devices are becoming increasingly more complex. Applications that perform keyword spotting, face ID, and intelligent sensing are often deployed within small, portable devices that must deliver high-performance AI inference and execute AI algorithms for neural networking models, in power-constrained solutions.
Processing
embedded world Product Showcase: ECS-DoT Ultra-Low-Power Edge AI SoC from EMASS
March 9, 2026
Modern edge AI applications are increasingly evolving. Devices such as hearables, wearables, AI cameras, and drones are being developed so that they no longer rely on centralized cloud AI, and instead can be supported by on-device AI that keeps data closer to the source, therefore improving latency, energy consumption, and bandwidth and connectivity limitations.
Industrial
Application Highlight: How Physical AI Hardware Platforms, AI SDKs, and Strategic Partnerships are Overcoming Old Pain Points
March 9, 2026
The world is ready for humanoid robots. Logistics and manufacturing face serious labor shortages, driving automation urgency. In healthcare, medical professionals are overstretched due to aging populations and staffing issues.
Open Source
embedded world Germany 2026 Dev Kit Zone
March 6, 2026
Embedded Computing Design is excited to reintroduce the Dev Kit Zone at embedded world 2026 in Nuremberg, Germany, March 10 – 12.
Industrial
Aetina Highlights DeviceEdge AIB-AT78/68 for Humanoid Robots at NVIDIA GTC 2026
March 18, 2026
Aetina Corporation is attending NVIDIA GTC 2026 to showcase its high-precision 3D vision technology and enterprise-grade Generative AI agents moving robots and automation systems toward end-to-end autonomy. Highlighted will be the DeviceEdge AIB-AT78/68 series edge supercomputing platform powered by NVIDIA Jetson Thor, and modular NVIDIA MGX Edge Servers with NVIDIA NIM microservices support.
AI & Machine Learning
Multimedia
March 20, 2026
The ECEDHA conference (Electrical and Computer Engineering Department Heads) is the first and largest event where Electrical and Computer Engineering (ECE) Academia and Industry come together to discuss the best way to prepare new graduates for their careers. Industry presents the trends in what skills they need to be competitive, and Academia presents the trends in teaching to prepare their students to enter the working world. There is great alignment, and much debate. It is attended by schools and companies both large and small, and it's happening in 2026, this third weekend of March. If you are working with ECE and are not attending, you have to ask yourself: "Why?"
AI & Machine Learning
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2026 embedded world: “Build Once, Scale Anywhere” Keynote by Microchip COO, Rich Simoncic
March 19, 2026
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Advantech to Demonstrate Robotics, Healthcare, and Retail Edge AI at NVIDIA GTC 2026
March 18, 2026
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The Role of Motor Control in Physical AI
March 16, 2026
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Embedder v0.3.1 AI-Powered Firmware Engineering Platform Nominated for Embedded Award 2026 in the Startup Category
March 16, 2026
Automotive
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From Design to Verification: Best Practices for Automotive Functional Safety Certification
February 05, 2026
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Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
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New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 04, 2026
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Embedded Editor: CES 2026 Trends Roundup
January 19, 2026
Debug & Test
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embedded world Germany: Upgraded TASKING Compiler Brings Integrated Compile, Debug, and Test for RH850 Architecture
March 04, 2026
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Mouser Product of the Week: Analog Devices’ EV-ADF4030SD1Z Evaluation Board
March 02, 2026
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embedded world Germany 2026: TASKING Toolchain Brings AI-Driven Compile, Debug, and Test for Safety-Critical Applications
February 12, 2026
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GÖPEL electronic to Highlight Video Dragon and FlashFOX at embedded world Germany 2026
January 28, 2026
Healthcare
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Empowering Real-Time Eye Health Diagnostics with ASUS IoT PE4000G Edge AI Computers
February 23, 2026
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Axiomtek’s mBOX603 Delivers High-Performance Medical Imaging and AI-Assisted Diagnostics
December 10, 2025
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Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
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Overcome Wi-Fi connectivity challenges for medical devices in hospitals and medical institutions
October 13, 2025
Industrial
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AI-Ready Wincomm WTP-9K66 Fanless Panel PCs Combine Hybrid CPU/NPU/GPU Architecture
March 18, 2026
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STMicroelectronics, NVIDIA Enable Faster Sim-to-Real Robotics Development
March 18, 2026
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Sfera Labs Introduces X2-Series LTE Expansion Board Enabling Cellular and GNSS Connectivity for Strato Pi Max
March 17, 2026
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Hilscher’s New cifX PCIe Cards Deliver Secure Industrial Communication with Multi-Protocol Support
March 16, 2026
Networking & 5G
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Ellisys and Metirionic Collaborate at embedded world to Demonstrate Bluetooth Channel Sounding Innovations
March 02, 2026
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The Hidden Complexity of Bluetooth Antenna Design in Channel Sounding
March 02, 2026
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Futuristic Embedded: Hospital AI, Bluetooth in Industrial, and DNA Storage
February 26, 2026
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Embedded Executive: LE-UWB Touts Low Power Plus High Bandwidth | SPARK Microsystems
February 18, 2026
Security
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Meeting the EU Cyber Resilience Act: Kudelski Labs Highlights Future-Ready Security Solutions at embedded world
March 03, 2026
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EU CRA: Guidance for Non-IP Embedded Communication Systems
February 24, 2026
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The Road to embedded world: PQShield Advances Post-Quantum Cryptography
February 17, 2026
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STM32 OTA Firmware Update
February 04, 2026
HPC/Datacenters
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BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
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Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
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Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025
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A Comprehensive Digital Twin Environment and Semiconductor Lifecycle Management Can Ensure Reliable Data-Center Operations
November 24, 2025