Industrial
Image Credit: Wincomm
AI-Ready Wincomm WTP-9K66 Fanless Panel PCs Combine Hybrid CPU/NPU/GPU Architecture

Chad Cox

March 18, 2026

Wincomm officially released its new flagship fanless industrial panel PC series featuring the 15” WTP-9K66-15 and the 21.5” WTP-9K66-22. The series was recently honored with the 2026 Taiwan Excellence Award, earned for Wincomm’s innovations in performance, hygiene, and sustainability for smart manufacturing and the food-pharma industries. The platforms leverage the latest Intel Core Ultra 125U processor and highlight a hybrid CPU/NPU/GPU architecture, delivering up to 22.5 TOPS AI performance at only 15 W power consumption. For secure, enterprise-grade management, the PCs incorporate TPM 2.0 on board and support Intel vPro Technology.

Multimedia

embedded world Recap, New oHFM Standard, & the Importance of Security

March 19, 2026

On this episode of Embedded Insiders, Editor-in-Chief Ken Briodagh sits down with Ansgar Hein, Chairman of the Board at SGET e.V., to discuss the new Open Harmonized FPGA Module (oHFM) standard, the world’s first open standard specifically designed for FPGA and SoC-FPGA modules. 

Watch the segment here: https://youtu.be/mDyAJ8gfpg8

Next, contributing editor Rich Nass is joined by Thistle Technologies’ Founder and CEO, Window Snyder, to discuss the importance of incorporating security into your design. 

But first, Ken, Rich, and I are back from embedded world 2026 in Nuremberg, and we’re giving you a recap of all the top trends and technologies we saw