Processing
Tria Technologies Unveils COM-HPC Computer-on-Module Powered by Intel Core Ultra Processors with 180 TOPS AI Performance
April 17, 2026
Tria Technologies launched the COM-HPC Client Computer-on-Module (CoM) leveraging the Intel Core Ultra Processors (Series 3). The module features an integrated AI accelerator (NPU) as well as Intel Xe graphics with up to 12 Xe cores, promoting up to 180 trillion operations per second (TOPS).
Security
Digi DAL OS Solutions Gain FIPS 140-3 Validation for Government and Regulated Industries
April 16, 2026
Digi International publicized an advancement in device security with the validation of FIPS 140-3 cryptographic modules across its portfolio of solutions based on the Digi Accelerated Linux (DAL) operating system including Digi EX, IX and TX Cellular Routers, Digi Connect IT Console Servers, Digi Connect EZ Serial Device and Terminal Servers, and Digi AnywhereUSB USB Over IP. According to the press release, Digi is the first provider of cellular connectivity solutions to achieve FIPS 140-3 validation without specialized SKUs.
Multimedia
ICYMI Ep 58: Siemens, eInfochips, MicroelectronicsUS
April 17, 2026
Hello Embedded Professionals, Engineers, and Developers! Welcome to In Case You Missed it, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.
Analog & Power
-
Embedded Executive: embedded world recap | DigiKey
April 08, 2026
-
Timing Is Now a Platform Decision: Why the Clock Must Come First
April 03, 2026
-
embedded world 2026 Podcast with Lattice Semiconductor
March 31, 2026
-
Timing Takes Center Stage: What Engineers Told Us About the Future of Electronic Design
March 19, 2026
Automotive
-
eSOL and Quintauris Partner to Expand Software Integration in RISC-V Automotive Platforms
March 23, 2026
-
How BASE-AU Enables High-Speed Optical Camera Links in Next-Generation Vehicles
March 05, 2026
-
From Design to Verification: Best Practices for Automotive Functional Safety Certification
February 05, 2026
-
Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
Debug & Test
-
Mouser Product of the Week: Analog Devices’ ADPA1112-EVALZ Evaluation Board
April 06, 2026
-
NI Connect 2026 to Highlight AI-Driven Productivity
March 24, 2026
-
The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems
March 16, 2026
-
embedded world Germany: Upgraded TASKING Compiler Brings Integrated Compile, Debug, and Test for RH850 Architecture
March 04, 2026
Healthcare
-
Wincomm’s New Medical All-in-One PCs Feature IP65 Front Panel, Built-In Power Supply, and “Clean Me” Mode
February 24, 2026
-
Empowering Real-Time Eye Health Diagnostics with ASUS IoT PE4000G Edge AI Computers
February 23, 2026
-
Axiomtek’s mBOX603 Delivers High-Performance Medical Imaging and AI-Assisted Diagnostics
December 10, 2025
-
Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
IoT
-
From COM Express to COM-HPC: Why High-Performance Embedded Systems Must Evolve
April 14, 2026
-
Nanomade Debuts Ultra-Sensitive Sensors
April 10, 2026
-
MSI IPC to Demo Smart Retail, Machine Vision, and Edge AI at Japan IT Week Spring 2026
April 03, 2026
-
Edge AI Solutions, The Memory Crisis, and Sustainable AI
April 02, 2026
Storage
-
embedded world 2026 Podcast with Rambus
March 27, 2026
-
Accelerate AI Workloads with Rambus HBM4E Memory Controller
March 05, 2026
-
Greenliant to Demo High-Endurance Industrial SSD Portfolio at embedded world Germany 2026
March 03, 2026
-
The Road to embedded world: Weebit ReRAM Powers Live Edge AI Silicon Demos
February 24, 2026
Networking & 5G
-
Digi International Launches Digi IX25: Rugged 5G Router for Industrial IoT and Critical Infrastructure
April 06, 2026
-
Qualcomm Announces 5G-Advanced Leap with Qualcomm X105 5G Modem-RF
March 04, 2026
-
Ellisys and Metirionic Collaborate at embedded world to Demonstrate Bluetooth Channel Sounding Innovations
March 02, 2026
-
The Hidden Complexity of Bluetooth Antenna Design in Channel Sounding
March 02, 2026
HPC/Datacenters
-
PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
-
BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
-
Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
-
Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025