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IoT

Debug Your Wireless IoT/Embedded Systems Remotely

Rich Nass

March 27, 2026

SSV Software Systems recently introduced its Wireless Remote Development services, designed to help developers maintain and update wireless IoT and embedded systems over long service lifetimes while addressing emerging European regulatory requirements such as the EU Cyber Resilience Act (CRA) and the Radio Equipment Directive Delegated Act.

Processing

Ultra-Low-Power Wireless SoC Integrates an NPU

Rich Nass

March 26, 2026

The Nordic Semiconductor nRF54LM20B is a wireless SoC in the company’s nRF54L series that combines an MCU, low-power wireless connectivity, and on-chip AI acceleration. The device integrates up to 2 Mbytes of nonvolatile memory and 512 kbytes of RAM, the largest memory configuration in the series.

IoT

Software Offers Seamless Cloud integration, Wireless Mesh-Network Management

Rich Nass

March 25, 2026

NeoCortec has introduced an updated version of its gateway software, called NeoCortec NeoGW, along with a new web-based network management application designed to simplify the integration and administration of wireless mesh networks based on the company’s NeoCortec NeoMesh protocol stack.

Industrial

Flexible Conductive Film Boasts High Transparency, Low Resistance

Rich Nass

March 24, 2026

Panasonic Industry recently introduced a transparent conductive film called FineX FineCross) designed for EMI shielding in applications where optical clarity must be maintained. The film targets systems such as displays, industrial equipment interfaces, and wireless communication environments where both visibility and electromagnetic control are required.

IoT

Product of the Week: Innodisk Corporation’s Intel Core Ultra Series 3 Reference Kit

Tiera Oliver

March 23, 2026

Pre-built hardware development solutions, like a reference kit, are often designed to accelerate the deployment of edge AI applications. These solutions provide support for AI building blocks, coupled with reliable, high-performance capabilities, and the seamless integration of robust, high-speed storage for edge AI workloads.

AI & Machine Learning

2026 embedded world: “Build Once, Scale Anywhere” Keynote by Microchip COO, Rich Simoncic

Tiera Oliver

March 19, 2026

There were many themes and trends discussed at the 2026 embedded world exhibition and conference in Nuremberg, Germany this year. Those being energy-efficiency and sustainability, security regulations like the Cyber Resilience Act (CRA), and, of course, one that will likely continue to be a topic for years to come and for many embedded computing companies, artificial intelligence (AI).

Analog & Power

Timing Takes Center Stage: What Engineers Told Us About the Future of Electronic Design

Piyush Sevalia

March 19, 2026

In the fast-paced world of electronic design, engineers often focus on processing, power consumption, connectivity, and performance as the key levers of innovation. But in 2025, something fundamental is shifting in the design process — and engineers are taking notice.

Debug & Test

The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems

Chad Cox

March 16, 2026

TASKING attended embedded world Germany where it showcased solutions that connect the full embedded software lifecycle from compile to debug and test through one integrated workflow ideal for automotive, aerospace and defense, industrial, and robotics applications.

AI & Machine Learning

The Role of Motor Control in Physical AI

Rich Nass

March 16, 2026

Physical AI is a term that’s in vogue right now. It refers to the application of AI to systems that directly interact with and influence the physical world. Unlike Cloud-based AI models that analyze data and produce insights, physical AI closes the loop between perception, decision-making, and actuation. It senses its environment, processes that data locally or at the Edge, and then potentially drives such equipment as motors, valves, pumps, or actuators. In short, it turns algorithms into action.

Industrial

The Road from embedded world: APLEX Demonstrates ATEX Explosion-Proof Panel PCs, Displays, and AVoIP Technology

Chad Cox

March 16, 2026

APLEX Technology Inc. thanks everyone who visited and supported it during embedded world Germany. During the show APLEX demonstrated its new ATEX explosion-proof solutions, including panel PCs, displays, and AVoIP (Audio and Video Over Internet Protocol) box.

Uncategorized

embedded world Germany 2026 Best-in-Show: Honorable Mention

Embedded Computing Design Staff

March 11, 2026

All entries are judged using a 15-point rubric that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.

Uncategorized

embedded world Germany 2026 Best-in-Show: Winners

Embedded Computing Design Staff

March 11, 2026

All entries are judged using a 15-point rubric that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.

IoT

The Road to embedded world: Ambarella Debuts Edge AI Innovations and Developer Tools

Chad Cox

March 9, 2026

Join Ambarella at Hall 5, Booth 5-355 during embedded world Germany where it will exhibit its AI SoCs, software stack, and developer tools that help teams build, integrate, and deploy edge AI solutions at scale. The booth is centered on the theme “The Ambarella Edge: From Agentic to Physical AI” and will have live demos highlighting innovations that offer a competitive advantage across various AI applications, from agentic automation and orchestration to physical AI systems operating in real-world environments.

IoT

Bosch Sensortec BMP585 Enables Precise Altitude Tracking in Snapdragon Wear Elite Devices

Chad Cox

March 27, 2026

Bosch Sensortec’s ultra-low power, high-performance BMP585 barometric pressure sensor now supports the Snapdragon Wear Elite Platform and is integrated into the Snapdragon Wear Elite Platform’s reference design. The platform delivers on-device AI capabilities with precise pressure data that allows for accurate altitude tracking and a new layer of contextual awareness for next-generation wearables.

Processing

Sundance SMT135-C Delivers Low-Power FPGA Performance for Vision and Edge Computing

Chad Cox

March 27, 2026

Sundance Multiprocessor Technology Ltd (Sundance) announced its SMT135-C, an Efinix Titanium Ti135 evaluation board based on the SoM6 Ti135 system-on-module (SoM) built around the Efinix Titanium Ti135 FPGA, in a N676 package.