Industrial
Innatera Highlights Brain-Inspired Computing for Sensing and Industrial Monitoring at embedded world
March 6, 2026
Innatera will be in Hall 3A, Booth 3A-430 at embedded world Germany, exhibiting its expanding portfolio of neuromorphic deployments developed with partners and customers. The booth focus is not just on how to implement architecture, but how brain-inspired computing is applied across sensing, industrial monitoring, and intelligent devices.
Processing
NXP i.MX 95–Driven OSM Module from Solectrix Medical Targets Advanced Diagnostic Systems at embedded world
March 6, 2026
At embedded world Germany, Solectrix Medical (Hall 4A, Booth 152) will exhibit an Open Standard Module (OSM) in the Size-M format based on the NXP i.MX 95 applications processor. The module was designed for a leader in the medical industry as part of its system strategy for diagnostic devices.
Multimedia
ICYMI Ep52 AI, Bluetooth, embedded world Best in Show!
March 6, 2026
Hello Embedded Professionals, Engineers, and Developers! Welcome to In Case You Missed it, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.
Industrial
-
Application Highlight: How Physical AI Hardware Platforms, AI SDKs, and Strategic Partnerships are Overcoming Old Pain Points
March 09, 2026
-
Innatera Highlights Brain-Inspired Computing for Sensing and Industrial Monitoring at embedded world
March 06, 2026
-
Three days, one mission: shaping the embedded future together
March 05, 2026
-
SECO Features NXP i.MX 95-Based Edge AI Solutions at embedded world Germany 2026
March 05, 2026
IoT
-
The Road to embedded world: Infineon Accelerates Edge AI and Power Design with PSOC MCUs
March 04, 2026
-
Embedded Executive: embedded world in Germany is Nearly Here | Axel Sikora
March 04, 2026
-
The Road to embedded world: APLEX Debuts NVIDIA Jetson-Powered Edge AI Systems and Stainless-Steel HMIs for Industrial and Food Processing Applications
March 04, 2026
-
The Road to embedded world: Sealevel Demonstrates Edge AI and Industrial I/O Solutions for Harsh Environments
March 02, 2026
Storage
-
Greenliant to Demo High-Endurance Industrial SSD Portfolio at embedded world Germany 2026
March 03, 2026
-
The Road to embedded world: Weebit ReRAM Powers Live Edge AI Silicon Demos
February 24, 2026
-
The Road to embedded world: BIWIN ePoP5X Combines LPDDR5X and eMMC for Space-Constrained AI Devices
February 22, 2026
-
The Road to embedded world: BIWIN Highlights TAU208 UFS 3.1 Automotive Storage
February 13, 2026
Networking & 5G
-
Ellisys and Metirionic Collaborate at embedded world to Demonstrate Bluetooth Channel Sounding Innovations
March 02, 2026
-
The Hidden Complexity of Bluetooth Antenna Design in Channel Sounding
March 02, 2026
-
Futuristic Embedded: Hospital AI, Bluetooth in Industrial, and DNA Storage
February 26, 2026
-
Embedded Executive: LE-UWB Touts Low Power Plus High Bandwidth | SPARK Microsystems
February 18, 2026
Open Source
-
Trends in Embedded: LVGL Innovation & A Countdown to embedded world 2026
March 05, 2026
-
DevTalk with Rich and Vin: HMIs and LVGL
March 03, 2026
-
The Zephyr Project Grows Membership, Highlights Security and Resilience at embedded world 2026
February 10, 2026
-
Mouser Product of the Week: NXP Semiconductors' FRDM-MCXE31B Development Board
February 09, 2026
Processing
-
embedded world Product Showcase: ECS-DoT Ultra-Low-Power Edge AI SoC from EMASS
March 09, 2026
-
NXP i.MX 95–Driven OSM Module from Solectrix Medical Targets Advanced Diagnostic Systems at embedded world
March 06, 2026
-
AMD to Showcase x86, FPGA & SoC for AI at embedded world
March 06, 2026
-
The Road to embedded world: Sundance Technical Session Explores its SMT135-C FPGA Evaluation Board
March 05, 2026
Software & OS
-
Infineon’s New ModusToolbox Power Suite Streamlines Digital Power Conversion Designs Using PSOC Control C3 MCUs
March 03, 2026
-
From IDEs to Integrated Suites: Embedded Development Tools Are Evolving Again
February 19, 2026
-
Building Trust in Embedded Systems & Smarter HMI Design
January 15, 2026
-
DevTalk with Rich and Vin: UI Design
January 09, 2026
HPC/Datacenters
-
BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
-
Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
-
Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025
-
A Comprehensive Digital Twin Environment and Semiconductor Lifecycle Management Can Ensure Reliable Data-Center Operations
November 24, 2025