Open Source
embedded world Germany 2026 Dev Kit Zone
March 6, 2026
Embedded Computing Design is excited to reintroduce the Dev Kit Zone at embedded world 2026 in Nuremberg, Germany, March 10 – 12.
Processing
The Road to embedded world: Sundance Technical Session Explores its SMT135-C FPGA Evaluation Board
March 5, 2026
Sundance will attend embedded world Germany where it will be located at the OpenSystems Media stand, Hall 1, Booth 500, showcasing its innovative SMT135-C. During the event, Chris Bowers, Sundance’s FPGA specialist, will lead an in-depth technical session on the SMT135-C where he will discuss the module’s highlights, performance capabilities, and suitable deployments. Engineers and developers will gain valuable insights into cutting-edge FPGA applications.
Automotive
How BASE-AU Enables High-Speed Optical Camera Links in Next-Generation Vehicles
March 5, 2026
The transition toward centralized and zonal vehicle architectures is placing new demands on how camera data is transported inside the vehicle. High-resolution optical cameras generate continuous multigigabit data streams that must be delivered reliably to domain controllers and central compute units. Existing in-vehicle network technologies, originally designed for lower data rates, are increasingly becoming a bottleneck.
This is where BASE-AU, the automotive-grade optical Ethernet standard defined under IEEE 802.3cz, comes into play.
Software & OS
The Road to embedded world: WITTENSTEIN high integrity systems Showcases SAFERTOS for Safety-Critical Environments
March 5, 2026
WITTENSTEIN high integrity systems (WHIS) will attend embedded world Germany where it will be in Hall 4, Booth 337 highlighting its RTOS solutions with proven evidence, global trust, certification leadership, and technology engineered from the ground up for safety critical embedded systems. WHIS offers fully pre-certified, standards compliant solutions purpose-built for safety-critical industries.
AI & Machine Learning
AI Playtime is Over: It is Time to Get Serious
March 4, 2026
Well, distinguished members of the (embedded industry) jury, I’m just a poor country lawyer (editor), and I don’t go in for all that newfangled LLM stuff that the big folks (you know who they are) are all on about. But the way I see it, as we get into embedded world, the time is about here to acknowledge that we’re doing serious work in the embedded industry, and we should probably put away the toys.
HPC/Datacenters
PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 4, 2026
In modern data center power architectures, a quarter brick (QB) solution plays a critical role by converting intermediate bus voltages to regulated outputs that power advanced processors. To meet stringent performance and reliability requirements, integrating a digital power system manager (PSM) has become essential.
HPC/Datacenters
BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 4, 2026
There’s a lot of talk about moving processing to the edge and of Edge AI taking over much of what servers used to do, but one company is creating a solution for bringing servers to the edge.
IoT
The Road to embedded world: Infineon Accelerates Edge AI and Power Design with PSOC MCUs
March 4, 2026
During embedded world Germany (March 10–12, Nuremberg), Infineon Technologies will showcase its latest PSOC microcontrollers, tools, and DEEPCRAFT AI Suite. Stop by Hall 4A, Booth 138 to explore new solutions across many applications and learn ways to accelerate your time-to-market on designs and AI/ML models.
AI & Machine Learning
From Data to Drain: How AI Is Devouring the World’s Electricity
March 4, 2026
America’s data centers managed to keep their electricity use surprisingly steady from 2005 to 2017, with rather small annual increments contained via constant improvement in electronics. Then, around 2017, AI arrived forcefully and disrupted that stability.
IoT
The Road to embedded world: APLEX Debuts NVIDIA Jetson-Powered Edge AI Systems and Stainless-Steel HMIs for Industrial and Food Processing Applications
March 4, 2026
APLEX Technology Inc. will be in Booth 3-533 at embedded world Germany exhibiting its innovations designed for harsh environments in industries such as oil and gas, food and beverage, maritime, and more. APLEX provides factory automation and food and beverage automation solutions.
Processing
The Road to embedded world: Join Trenz to Discover Next-Gen FPGA and Edge AI Hardware
March 3, 2026
Trenz will be bringing its lineup of brand-new hardware to embedded world Germany. At its booth, 5-140, Trenz will showcase ten new products (seven AMD-based and three Altera-based solutions) covering everything from budget friendly FPGA platforms and high-IO designs to RF signal processing and next-generation edge AI.
Networking & 5G
The Hidden Complexity of Bluetooth Antenna Design in Channel Sounding
March 2, 2026
Bluetooth is often seen as a “plug-and-play” technology for embedded systems. Drop in a module, connect a few traces, and you’re done—right? Not quite, and especially with Channel Sounding. Behind the scenes, antenna design can make or break your product’s performance. Poor decisions lead to reduced range, higher power consumption, and even failed certifications.
IoT
The Road to embedded world: Sealevel Demonstrates Edge AI and Industrial I/O Solutions for Harsh Environments
March 2, 2026
At embedded world Germany 2026, Sealevel will showcase its embedded computing and industrial I/O platforms ideal for power connected systems across automation, edge intelligence, machine control, vision systems, and high-performance data applications.
Industrial
Innatera Highlights Brain-Inspired Computing for Sensing and Industrial Monitoring at embedded world
March 6, 2026
Innatera will be in Hall 3A, Booth 3A-430 at embedded world Germany, exhibiting its expanding portfolio of neuromorphic deployments developed with partners and customers. The booth focus is not just on how to implement architecture, but how brain-inspired computing is applied across sensing, industrial monitoring, and intelligent devices.
Processing
NXP i.MX 95–Driven OSM Module from Solectrix Medical Targets Advanced Diagnostic Systems at embedded world
March 6, 2026
At embedded world Germany, Solectrix Medical (Hall 4A, Booth 152) will exhibit an Open Standard Module (OSM) in the Size-M format based on the NXP i.MX 95 applications processor. The module was designed for a leader in the medical industry as part of its system strategy for diagnostic devices.
Debug & Test
embedded world Germany: Upgraded TASKING Compiler Brings Integrated Compile, Debug, and Test for RH850 Architecture
March 4, 2026
embedded world Germany 2026: TASKING Toolchain Brings AI-Driven Compile, Debug, and Test for Safety-Critical Applications
February 12, 2026
Multimedia
ICYMI Ep52 AI, Bluetooth, embedded world Best in Show!
March 6, 2026
Hello Embedded Professionals, Engineers, and Developers! Welcome to In Case You Missed it, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.
Consumer
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Create reliable, power efficient and safe home appliance designs with a PSOC™ Control C3 and CoolGaN™ solution
February 18, 2026
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Tear Down: Google Pixel Watch 4
February 03, 2026
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TDK Adds SmartMotion for Smart Glasses to its Custom Sensing Solutions for AI Glasses and Augmented Reality
September 30, 2025
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Arm Delivers Personal AI on Consumer Devices with New Lumex CSS Platform
September 10, 2025
Healthcare
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Empowering Real-Time Eye Health Diagnostics with ASUS IoT PE4000G Edge AI Computers
February 23, 2026
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Axiomtek’s mBOX603 Delivers High-Performance Medical Imaging and AI-Assisted Diagnostics
December 10, 2025
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Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
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Overcome Wi-Fi connectivity challenges for medical devices in hospitals and medical institutions
October 13, 2025
Industrial
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Three days, one mission: shaping the embedded future together
March 05, 2026
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SECO Features NXP i.MX 95-Based Edge AI Solutions at embedded world Germany 2026
March 05, 2026
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Akasa AK-CC7409BP01 Offers 125W Cooling in a 29.5mm Low-Profile Design for Intel LGA1851 and LGA1700
March 04, 2026
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NVIDIA Sponsors New Humanoid Robot Pavilion at Automate 2026
February 27, 2026
IoT
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Embedded Executive: embedded world in Germany is Nearly Here | Axel Sikora
March 04, 2026
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The Road to embedded world: APLEX Debuts NVIDIA Jetson-Powered Edge AI Systems and Stainless-Steel HMIs for Industrial and Food Processing Applications
March 04, 2026
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The Road to embedded world: Sealevel Demonstrates Edge AI and Industrial I/O Solutions for Harsh Environments
March 02, 2026
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embedded world Germany: NEXCOM Introduces APPC C21-01 Fanless Panel PCs to Bridge Industrial Automation and Edge AI
February 27, 2026
Networking & 5G
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Ellisys and Metirionic Collaborate at embedded world to Demonstrate Bluetooth Channel Sounding Innovations
March 02, 2026
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The Hidden Complexity of Bluetooth Antenna Design in Channel Sounding
March 02, 2026
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Futuristic Embedded: Hospital AI, Bluetooth in Industrial, and DNA Storage
February 26, 2026
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Embedded Executive: LE-UWB Touts Low Power Plus High Bandwidth | SPARK Microsystems
February 18, 2026
Open Source
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Trends in Embedded: LVGL Innovation & A Countdown to embedded world 2026
March 05, 2026
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DevTalk with Rich and Vin: HMIs and LVGL
March 03, 2026
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The Zephyr Project Grows Membership, Highlights Security and Resilience at embedded world 2026
February 10, 2026
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Mouser Product of the Week: NXP Semiconductors' FRDM-MCXE31B Development Board
February 09, 2026
Software & OS
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Infineon’s New ModusToolbox Power Suite Streamlines Digital Power Conversion Designs Using PSOC Control C3 MCUs
March 03, 2026
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From IDEs to Integrated Suites: Embedded Development Tools Are Evolving Again
February 19, 2026
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Building Trust in Embedded Systems & Smarter HMI Design
January 15, 2026
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DevTalk with Rich and Vin: UI Design
January 09, 2026
HPC/Datacenters
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BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
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Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
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Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025
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A Comprehensive Digital Twin Environment and Semiconductor Lifecycle Management Can Ensure Reliable Data-Center Operations
November 24, 2025