IoT
Debug Your Wireless IoT/Embedded Systems Remotely
March 27, 2026
SSV Software Systems recently introduced its Wireless Remote Development services, designed to help developers maintain and update wireless IoT and embedded systems over long service lifetimes while addressing emerging European regulatory requirements such as the EU Cyber Resilience Act (CRA) and the Radio Equipment Directive Delegated Act.
Processing
Ultra-Low-Power Wireless SoC Integrates an NPU
March 26, 2026
The Nordic Semiconductor nRF54LM20B is a wireless SoC in the company’s nRF54L series that combines an MCU, low-power wireless connectivity, and on-chip AI acceleration. The device integrates up to 2 Mbytes of nonvolatile memory and 512 kbytes of RAM, the largest memory configuration in the series.
IoT
Software Offers Seamless Cloud integration, Wireless Mesh-Network Management
March 25, 2026
NeoCortec has introduced an updated version of its gateway software, called NeoCortec NeoGW, along with a new web-based network management application designed to simplify the integration and administration of wireless mesh networks based on the company’s NeoCortec NeoMesh protocol stack.
Industrial
Flexible Conductive Film Boasts High Transparency, Low Resistance
March 24, 2026
Panasonic Industry recently introduced a transparent conductive film called FineX FineCross) designed for EMI shielding in applications where optical clarity must be maintained. The film targets systems such as displays, industrial equipment interfaces, and wireless communication environments where both visibility and electromagnetic control are required.
IoT
Product of the Week: Innodisk Corporation’s Intel Core Ultra Series 3 Reference Kit
March 23, 2026
Pre-built hardware development solutions, like a reference kit, are often designed to accelerate the deployment of edge AI applications. These solutions provide support for AI building blocks, coupled with reliable, high-performance capabilities, and the seamless integration of robust, high-speed storage for edge AI workloads.
AI & Machine Learning
2026 embedded world: “Build Once, Scale Anywhere” Keynote by Microchip COO, Rich Simoncic
March 19, 2026
There were many themes and trends discussed at the 2026 embedded world exhibition and conference in Nuremberg, Germany this year. Those being energy-efficiency and sustainability, security regulations like the Cyber Resilience Act (CRA), and, of course, one that will likely continue to be a topic for years to come and for many embedded computing companies, artificial intelligence (AI).
Analog & Power
Timing Takes Center Stage: What Engineers Told Us About the Future of Electronic Design
March 19, 2026
In the fast-paced world of electronic design, engineers often focus on processing, power consumption, connectivity, and performance as the key levers of innovation. But in 2025, something fundamental is shifting in the design process — and engineers are taking notice.
Debug & Test
The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems
March 16, 2026
TASKING attended embedded world Germany where it showcased solutions that connect the full embedded software lifecycle from compile to debug and test through one integrated workflow ideal for automotive, aerospace and defense, industrial, and robotics applications.
AI & Machine Learning
The Role of Motor Control in Physical AI
March 16, 2026
Physical AI is a term that’s in vogue right now. It refers to the application of AI to systems that directly interact with and influence the physical world. Unlike Cloud-based AI models that analyze data and produce insights, physical AI closes the loop between perception, decision-making, and actuation. It senses its environment, processes that data locally or at the Edge, and then potentially drives such equipment as motors, valves, pumps, or actuators. In short, it turns algorithms into action.
Industrial
The Road from embedded world: APLEX Demonstrates ATEX Explosion-Proof Panel PCs, Displays, and AVoIP Technology
March 16, 2026
APLEX Technology Inc. thanks everyone who visited and supported it during embedded world Germany. During the show APLEX demonstrated its new ATEX explosion-proof solutions, including panel PCs, displays, and AVoIP (Audio and Video Over Internet Protocol) box.
Uncategorized
embedded world Germany 2026 Best-in-Show: Honorable Mention
March 11, 2026
All entries are judged using a 15-point rubric that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.
Uncategorized
embedded world Germany 2026 Best-in-Show: Winners
March 11, 2026
All entries are judged using a 15-point rubric that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.
IoT
The Road to embedded world: Ambarella Debuts Edge AI Innovations and Developer Tools
March 9, 2026
Join Ambarella at Hall 5, Booth 5-355 during embedded world Germany where it will exhibit its AI SoCs, software stack, and developer tools that help teams build, integrate, and deploy edge AI solutions at scale. The booth is centered on the theme “The Ambarella Edge: From Agentic to Physical AI” and will have live demos highlighting innovations that offer a competitive advantage across various AI applications, from agentic automation and orchestration to physical AI systems operating in real-world environments.
Security
Axelera AI Integrates Kudelski Secure Enclave into Europa Edge AI Platform
March 27, 2026
During embedded world Germany, Kudelski Labs revealed that Axelera AI integrated the Kudelski Secure Enclave, robust to AVA_VAN.3 (“KSE3”) into Europa, its new Edge AI processing platform. The joint effort strengthens Europa’s security architecture, ensuring advanced inference workloads can be executed with assurance across rigorous edge environments such as smart infrastructure, industrial automation, and autonomous robotics.
IoT
Bosch Sensortec BMP585 Enables Precise Altitude Tracking in Snapdragon Wear Elite Devices
March 27, 2026
Bosch Sensortec’s ultra-low power, high-performance BMP585 barometric pressure sensor now supports the Snapdragon Wear Elite Platform and is integrated into the Snapdragon Wear Elite Platform’s reference design. The platform delivers on-device AI capabilities with precise pressure data that allows for accurate altitude tracking and a new layer of contextual awareness for next-generation wearables.
Multimedia
embedded world 2026 Podcast with Rambus
March 27, 2026
Systems are demanding more from their memory subsystems, and they can get it thanks to the latest controller from Rambus, as evidenced in the discussion between Rambus' Bart Stevens and Embedded Computing Design's Rich Nass.
AI & Machine Learning
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Kontron KBox A‑151 EAI Now Powered by SiMa.ai Physical AI for Industrial Edge
March 20, 2026
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2026 embedded world: “Build Once, Scale Anywhere” Keynote by Microchip COO, Rich Simoncic
March 19, 2026
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Advantech to Demonstrate Robotics, Healthcare, and Retail Edge AI at NVIDIA GTC 2026
March 18, 2026
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The Role of Motor Control in Physical AI
March 16, 2026
Healthcare
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Empowering Real-Time Eye Health Diagnostics with ASUS IoT PE4000G Edge AI Computers
February 23, 2026
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Axiomtek’s mBOX603 Delivers High-Performance Medical Imaging and AI-Assisted Diagnostics
December 10, 2025
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Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
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Overcome Wi-Fi connectivity challenges for medical devices in hospitals and medical institutions
October 13, 2025
Industrial
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VIA Labs Introduces Industrial USB 5Gbps and 10Gbps Hub Controllers for Machine Vision and Data Acquisition
March 26, 2026
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element14 Smart Industry Challenge Offers Engineers a Chance to Build Prototypes and Win Test Equipment
March 25, 2026
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Flexible Conductive Film Boasts High Transparency, Low Resistance
March 24, 2026
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Aetina Highlights DeviceEdge AIB-AT78/68 for Humanoid Robots at NVIDIA GTC 2026
March 18, 2026
IoT
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Cincoze DX-1300 Delivers Hybrid CPU-GPU-NPU Power for Edge AI in Harsh Environments
March 27, 2026
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IBASE Launches ASB100-PI800 Palm-Sized Fanless Edge PC with Intel Atom x7433RE
March 27, 2026
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Debug Your Wireless IoT/Embedded Systems Remotely
March 27, 2026
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Software Offers Seamless Cloud integration, Wireless Mesh-Network Management
March 25, 2026
Storage
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Accelerate AI Workloads with Rambus HBM4E Memory Controller
March 05, 2026
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Greenliant to Demo High-Endurance Industrial SSD Portfolio at embedded world Germany 2026
March 03, 2026
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The Road to embedded world: Weebit ReRAM Powers Live Edge AI Silicon Demos
February 24, 2026
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The Road to embedded world: BIWIN ePoP5X Combines LPDDR5X and eMMC for Space-Constrained AI Devices
February 22, 2026
Processing
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Trenz Electronic Showcases 10 New FPGA Platforms at embedded world Germany
March 26, 2026
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Ultra-Low-Power Wireless SoC Integrates an NPU
March 26, 2026
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embedded world 2026 Podcast with Tria Technologies
March 23, 2026
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embedded world Product Showcase: Ambient Scientific’s GPX10 Pro
March 09, 2026
Security
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The EU Cyber Resilience Act & Industrial Power Conversion in Data Centers
March 26, 2026
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Embedded Executive: Once Again, You MUST Implement Security | Thistle Technologies
March 18, 2026
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Meeting the EU Cyber Resilience Act: Kudelski Labs Highlights Future-Ready Security Solutions at embedded world
March 03, 2026
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EU CRA: Guidance for Non-IP Embedded Communication Systems
February 24, 2026
Software & OS
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Infineon’s New ModusToolbox Power Suite Streamlines Digital Power Conversion Designs Using PSOC Control C3 MCUs
March 03, 2026
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From IDEs to Integrated Suites: Embedded Development Tools Are Evolving Again
February 19, 2026
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Building Trust in Embedded Systems & Smarter HMI Design
January 15, 2026
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DevTalk with Rich and Vin: UI Design
January 09, 2026