Analog & Power
Timing Is Now a Platform Decision: Why the Clock Must Come First
April 3, 2026
According to SiTime’s new State of Time 2025 report, half of all engineers responding to the survey stated that they consider timing component options at the beginning of the system design process. This is a major shift in system design practices, and it’s happening across multiple industries, from AI and edge compute to aerospace and industrial automation.
Healthcare
Mobile HMI and Healthcare: How Embedded is Enhancing Medical Facility Operations
April 3, 2026
While there are many facets of human machine interfaces (HMI), a growing trend is how Mobile HMI can be used to improve medical environments. HMIs are no longer fixed panels on a wall. Walk through any medical facility, and one will witness multiple users rolling mobile carts or holding hand-held devices. Mobile HMIs range from tablets and smart panel PCs to smartphones.
Industrial
Sapphire Technology at embedded world 2026
April 1, 2026
Paul Smith, Senior Director at Sapphire Technologies, walks Embedded Computing Design's Rich Nass through a series of the company's products.
Automotive
ISO 8800 Is Coming to Your Next Platform Program — Are You Ready?
March 30, 2026
For the past decade, ISO 26262 has been the governing framework for functional safety in road vehicles. It established how automotive engineers think about hazard analysis, safety goals, ASIL decomposition, and the lifecycle of safety-critical systems. It is now deeply embedded in how semiconductor IP vendors, Tier 1 suppliers, and OEMs design and certify their products.
IoT
Debug Your Wireless IoT/Embedded Systems Remotely
March 27, 2026
SSV Software Systems recently introduced its Wireless Remote Development services, designed to help developers maintain and update wireless IoT and embedded systems over long service lifetimes while addressing emerging European regulatory requirements such as the EU Cyber Resilience Act (CRA) and the Radio Equipment Directive Delegated Act.
Processing
Ultra-Low-Power Wireless SoC Integrates an NPU
March 26, 2026
The Nordic Semiconductor nRF54LM20B is a wireless SoC in the company’s nRF54L series that combines an MCU, low-power wireless connectivity, and on-chip AI acceleration. The device integrates up to 2 Mbytes of nonvolatile memory and 512 kbytes of RAM, the largest memory configuration in the series.
IoT
Software Offers Seamless Cloud integration, Wireless Mesh-Network Management
March 25, 2026
NeoCortec has introduced an updated version of its gateway software, called NeoCortec NeoGW, along with a new web-based network management application designed to simplify the integration and administration of wireless mesh networks based on the company’s NeoCortec NeoMesh protocol stack.
Industrial
Flexible Conductive Film Boasts High Transparency, Low Resistance
March 24, 2026
Panasonic Industry recently introduced a transparent conductive film called FineX FineCross) designed for EMI shielding in applications where optical clarity must be maintained. The film targets systems such as displays, industrial equipment interfaces, and wireless communication environments where both visibility and electromagnetic control are required.
IoT
Product of the Week: Innodisk Corporation’s Intel Core Ultra Series 3 Reference Kit
March 23, 2026
Pre-built hardware development solutions, like a reference kit, are often designed to accelerate the deployment of edge AI applications. These solutions provide support for AI building blocks, coupled with reliable, high-performance capabilities, and the seamless integration of robust, high-speed storage for edge AI workloads.
AI & Machine Learning
2026 embedded world: “Build Once, Scale Anywhere” Keynote by Microchip COO, Rich Simoncic
March 19, 2026
There were many themes and trends discussed at the 2026 embedded world exhibition and conference in Nuremberg, Germany this year. Those being energy-efficiency and sustainability, security regulations like the Cyber Resilience Act (CRA), and, of course, one that will likely continue to be a topic for years to come and for many embedded computing companies, artificial intelligence (AI).
Analog & Power
Timing Takes Center Stage: What Engineers Told Us About the Future of Electronic Design
March 19, 2026
In the fast-paced world of electronic design, engineers often focus on processing, power consumption, connectivity, and performance as the key levers of innovation. But in 2025, something fundamental is shifting in the design process — and engineers are taking notice.
Debug & Test
The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems
March 16, 2026
TASKING attended embedded world Germany where it showcased solutions that connect the full embedded software lifecycle from compile to debug and test through one integrated workflow ideal for automotive, aerospace and defense, industrial, and robotics applications.
AI & Machine Learning
The Role of Motor Control in Physical AI
March 16, 2026
Physical AI is a term that’s in vogue right now. It refers to the application of AI to systems that directly interact with and influence the physical world. Unlike Cloud-based AI models that analyze data and produce insights, physical AI closes the loop between perception, decision-making, and actuation. It senses its environment, processes that data locally or at the Edge, and then potentially drives such equipment as motors, valves, pumps, or actuators. In short, it turns algorithms into action.
IoT
MSI IPC to Demo Smart Retail, Machine Vision, and Edge AI at Japan IT Week Spring 2026
April 3, 2026
MSI IPC will attend Japan IT Week Spring 2026 from April 8th to 10th in Tokyo, Japan. MSI IPC will be in West Hall 3, Booth #W21-22 where it will exhibit its latest Edge AI computing solutions via live demonstrations developed for real world industrial and commercial applications.
Industrial
VadaTech Launches PCI598 PCIe FPGA with AMD XCVP1902 VersalTM Premium Series
April 2, 2026
VadaTech introduced its PCI598 - PCIe FPGA with quad QSFP-DD XCVP1902 VersalTM Premium Series, based on the AMD XCVP1902 VersalTM Premium Series FPGA. It delivers more than 6,800 DSP slices with total PL memory of 1116Mb and 8,460,288 LUTs.
Multimedia
ICYMI: Ep56 Axelera AI, Bosch, SSV Software
April 3, 2026
Hello Embedded Professionals, Engineers, and Developers! Welcome to In Case You Missed it, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.
Analog & Power
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embedded world 2026 Podcast with Lattice Semiconductor
March 31, 2026
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Timing Takes Center Stage: What Engineers Told Us About the Future of Electronic Design
March 19, 2026
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embedded world Recap, New oHFM Standard, & the Importance of Security
March 19, 2026
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Nanopower Announces Volume Production of nPZero Power-Saving IC
March 16, 2026
Consumer
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Create reliable, power efficient and safe home appliance designs with a PSOC™ Control C3 and CoolGaN™ solution
February 18, 2026
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Tear Down: Google Pixel Watch 4
February 03, 2026
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TDK Adds SmartMotion for Smart Glasses to its Custom Sensing Solutions for AI Glasses and Augmented Reality
September 30, 2025
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Arm Delivers Personal AI on Consumer Devices with New Lumex CSS Platform
September 10, 2025
Debug & Test
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The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems
March 16, 2026
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embedded world Germany: Upgraded TASKING Compiler Brings Integrated Compile, Debug, and Test for RH850 Architecture
March 04, 2026
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Mouser Product of the Week: Analog Devices’ EV-ADF4030SD1Z Evaluation Board
March 02, 2026
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embedded world Germany 2026: TASKING Toolchain Brings AI-Driven Compile, Debug, and Test for Safety-Critical Applications
February 12, 2026
Healthcare
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Wincomm’s New Medical All-in-One PCs Feature IP65 Front Panel, Built-In Power Supply, and “Clean Me” Mode
February 24, 2026
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Empowering Real-Time Eye Health Diagnostics with ASUS IoT PE4000G Edge AI Computers
February 23, 2026
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Axiomtek’s mBOX603 Delivers High-Performance Medical Imaging and AI-Assisted Diagnostics
December 10, 2025
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Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
Industrial
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COMPUTEX 2026: Your Guide for Event Details, What to Expect, and Key Tips for Success
April 01, 2026
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VadaTech VT808 3U Rugged Chassis Supports Four PCIe Gen5 x16 Modules
April 01, 2026
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Sapphire Technology at embedded world 2026
April 01, 2026
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Tria Launches SPB611 and SPB209 Wireless Modules with Wi-Fi 6 and Bluetooth 5.2
March 27, 2026
IoT
MSI IPC to Demo Smart Retail, Machine Vision, and Edge AI at Japan IT Week Spring 2026
April 3, 2026
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Edge AI Solutions, The Memory Crisis, and Sustainable AI
April 02, 2026
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MediaTek Press Conference at embedded world 2026
March 31, 2026
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Bosch Sensortec BMP585 Enables Precise Altitude Tracking in Snapdragon Wear Elite Devices
March 27, 2026
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Cincoze DX-1300 Delivers Hybrid CPU-GPU-NPU Power for Edge AI in Harsh Environments
March 27, 2026
Processing
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Trenz Electronic Showcases 10 New FPGA Platforms at embedded world Germany
March 26, 2026
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Ultra-Low-Power Wireless SoC Integrates an NPU
March 26, 2026
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embedded world 2026 Podcast with Tria Technologies
March 23, 2026
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embedded world Product Showcase: Ambient Scientific’s GPX10 Pro
March 09, 2026
HPC/Datacenters
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PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
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BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
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Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
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Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025