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Debug & Test

Mouser Product of the Week: Analog Devices’ ADPA1112-EVALZ Evaluation Board

Tiera Oliver

April 6, 2026

Test and evaluation are critical and repetitive processes for engineers working with a wide variety of applications, especially those that are safety-critical. Development and test platforms are designed to support engineers developing these systems, providing ready-to-use and fully equipped solutions that measure and support the reuse or adaptation of designs to fit existing systems.

Analog & Power

Timing Is Now a Platform Decision: Why the Clock Must Come First

Piyush Sevalia

April 3, 2026

According to SiTime’s new State of Time 2025 report, half of all engineers responding to the survey stated that they consider timing component options at the beginning of the system design process. This is a major shift in system design practices, and it’s happening across multiple industries, from AI and edge compute to aerospace and industrial automation.

Healthcare

Mobile HMI and Healthcare: How Embedded is Enhancing Medical Facility Operations

Chad Cox

April 3, 2026

While there are many facets of human machine interfaces (HMI), a growing trend is how Mobile HMI can be used to improve medical environments. HMIs are no longer fixed panels on a wall. Walk through any medical facility, and one will witness multiple users rolling mobile carts or holding hand-held devices. Mobile HMIs range from tablets and smart panel PCs to smartphones.

Industrial

Sapphire Technology at embedded world 2026

Chad Cox

April 1, 2026

Paul Smith, Senior Director at Sapphire Technologies, walks Embedded Computing Design's Rich Nass through a series of the company's products.

Automotive

ISO 8800 Is Coming to Your Next Platform Program — Are You Ready?

Sandeep Kumar Bomthapalli

March 30, 2026

For the past decade, ISO 26262 has been the governing framework for functional safety in road vehicles. It established how automotive engineers think about hazard analysis, safety goals, ASIL decomposition, and the lifecycle of safety-critical systems. It is now deeply embedded in how semiconductor IP vendors, Tier 1 suppliers, and OEMs design and certify their products.

IoT

Debug Your Wireless IoT/Embedded Systems Remotely

Rich Nass

March 27, 2026

SSV Software Systems recently introduced its Wireless Remote Development services, designed to help developers maintain and update wireless IoT and embedded systems over long service lifetimes while addressing emerging European regulatory requirements such as the EU Cyber Resilience Act (CRA) and the Radio Equipment Directive Delegated Act.

Processing

Ultra-Low-Power Wireless SoC Integrates an NPU

Rich Nass

March 26, 2026

The Nordic Semiconductor nRF54LM20B is a wireless SoC in the company’s nRF54L series that combines an MCU, low-power wireless connectivity, and on-chip AI acceleration. The device integrates up to 2 Mbytes of nonvolatile memory and 512 kbytes of RAM, the largest memory configuration in the series.

IoT

Software Offers Seamless Cloud integration, Wireless Mesh-Network Management

Rich Nass

March 25, 2026

NeoCortec has introduced an updated version of its gateway software, called NeoCortec NeoGW, along with a new web-based network management application designed to simplify the integration and administration of wireless mesh networks based on the company’s NeoCortec NeoMesh protocol stack.

Industrial

Flexible Conductive Film Boasts High Transparency, Low Resistance

Rich Nass

March 24, 2026

Panasonic Industry recently introduced a transparent conductive film called FineX FineCross) designed for EMI shielding in applications where optical clarity must be maintained. The film targets systems such as displays, industrial equipment interfaces, and wireless communication environments where both visibility and electromagnetic control are required.

IoT

Product of the Week: Innodisk Corporation’s Intel Core Ultra Series 3 Reference Kit

Tiera Oliver

March 23, 2026

Pre-built hardware development solutions, like a reference kit, are often designed to accelerate the deployment of edge AI applications. These solutions provide support for AI building blocks, coupled with reliable, high-performance capabilities, and the seamless integration of robust, high-speed storage for edge AI workloads.

AI & Machine Learning

2026 embedded world: “Build Once, Scale Anywhere” Keynote by Microchip COO, Rich Simoncic

Tiera Oliver

March 19, 2026

There were many themes and trends discussed at the 2026 embedded world exhibition and conference in Nuremberg, Germany this year. Those being energy-efficiency and sustainability, security regulations like the Cyber Resilience Act (CRA), and, of course, one that will likely continue to be a topic for years to come and for many embedded computing companies, artificial intelligence (AI).

Analog & Power

Timing Takes Center Stage: What Engineers Told Us About the Future of Electronic Design

Piyush Sevalia

March 19, 2026

In the fast-paced world of electronic design, engineers often focus on processing, power consumption, connectivity, and performance as the key levers of innovation. But in 2025, something fundamental is shifting in the design process — and engineers are taking notice.

Debug & Test

The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems

Chad Cox

March 16, 2026

TASKING attended embedded world Germany where it showcased solutions that connect the full embedded software lifecycle from compile to debug and test through one integrated workflow ideal for automotive, aerospace and defense, industrial, and robotics applications.

Edge AI

IBASE MBB1002 Delivers AI Acceleration with AMD EPYC Embedded 8004 and PCIe Gen5

Chad Cox

April 9, 2026

IBASE Technology Inc. introduced the AMD EPYC Embedded 8004 powered MBB1002, an AI eATX motherboard developed to deliver enhanced multi-core performance and power efficiency, aiding faster AI inference, real-time analytics, and high-throughput computing for edge AI and data-intensive applications.

Processing

Codasip Shifts Focus to Cyber-Resilient SoCs, Divests Low-End RISC-V Business

Chad Cox

April 9, 2026

Codasip announced it will put more focus of its business into cyber-resilient semiconductor architectures and semiconductor System on Chips (SoCs). Because of the change, the company will divest its low-end RISC-V processor design business to a public US semiconductor company. The purchaser will also take a broad license to Studio, Codasip’s processor EDA tool that allows rapid customization of Codasip processor cores. The acquisition is planned to close in a month.