Press Releases
Automotive
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Versinetic Showcases Load Balancing Technology and EV Charger Development Kits at POWER2DRIVE Europe
May 16, 2022
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NXP at Embedded World 2022
May 13, 2022
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STMicroelectronics Cooperates With Semikron to Integrate Silicon-Carbide Power Technology in Next-Generation Electric-Vehicle Drives
May 13, 2022
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HERE Collaborates with AWS on Supply Chain Solutions to Improve End-to-End Visibility and Fleet Efficiency
May 10, 2022
Storage
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Alliance Memory to Highlight Latest SRAM, DRAM, Flash, and Storage Memory ICs at Embedded World 2022
May 06, 2022
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Winbond Proceeds with More DDR3 SDRAM Production
April 25, 2022
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DIGISTOR Poised to Receive Common Criteria Certification For FIPS Self-Encrypting Drives in 2022
April 18, 2022
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Swissbit Introduces "powersafe" for Advanced Power Loss Protection in Industrial SSDs
April 12, 2022
Open Source
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Intel Open-Sources SYCLomatic Migration Tool to Help Developers Create Heterogeneous Code
May 20, 2022
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AMD Releases New Robotics Starter Kit for Upgrading the Intelligent Factory of the Future
May 20, 2022
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Embedded Executive: Sailesh Chittipeddi, EVP & GM of the IoT and Infrastructure Business Unit, Renesas
May 18, 2022
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Experimental Foot Pedal Computer Interface
May 16, 2022
Processing
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Imagination: Connecting Embedded Intelligence at embedded world 2022
May 19, 2022
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The Premier Event for Embedded Tech Solutions
May 19, 2022
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Arm Deployments with i.MX 8M Plus Simplified by congatec
May 19, 2022
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The Problem with the CHIPS Act, Part 1
May 19, 2022