Technology - Processing
Processing
Rapidus Unveils Analysis Center and its Rapidus Chiplet Solutions Hub for Next-Gen Semiconductor Manufacturing
April 14, 2026
Rapidus Corporation announced the opening of an Analysis Center and its Rapidus Chiplet Solutions (RCS). The center is nearby Rapidus’ Innovative Integration for Manufacturing (IIM-1) semiconductor foundry in Chitose, Hokkaido. The facility conducts the physical analysis, environmental and chemical analysis, electrical characterization, and reliability testing required for the design of next-generation logic semiconductors.
Processing
Siemens Veloce proFPGA CS AI Chip Delivers Verification to Trillion‑Cycle Scale
April 13, 2026
Siemens, in collaboration with NVIDIA, publicized that its Veloce proFPGA CS hardware-assisted verification and validation system is enabling the efficient creation of enhanced designs by running and capturing trillions of verification cycles, prior to first silicon availability.
Processing
embedded world 2026 Podcast with SCI Semiconductor
April 10, 2026
Haydn Povey of SCI Semiconductor discusses the world's most secure microcontroller with Rich Nass, from Embedded Computing Design.
Processing
Consumer
-
Create reliable, power efficient and safe home appliance designs with a PSOC™ Control C3 and CoolGaN™ solution
February 18, 2026
-
Tear Down: Google Pixel Watch 4
February 03, 2026
-
TDK Adds SmartMotion for Smart Glasses to its Custom Sensing Solutions for AI Glasses and Augmented Reality
September 30, 2025
-
Arm Delivers Personal AI on Consumer Devices with New Lumex CSS Platform
September 10, 2025
Debug & Test
-
Mouser Product of the Week: Analog Devices’ ADPA1112-EVALZ Evaluation Board
April 06, 2026
-
NI Connect 2026 to Highlight AI-Driven Productivity
March 24, 2026
-
The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems
March 16, 2026
-
embedded world Germany: Upgraded TASKING Compiler Brings Integrated Compile, Debug, and Test for RH850 Architecture
March 04, 2026
HPC/Datacenters
-
PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
-
BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
-
Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
-
Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025
Edge AI
-
Why In-Domain ASR Is the Missing Link for Real Edge AI Deployment
April 10, 2026
-
IBASE MBB1002 Delivers AI Acceleration with AMD EPYC Embedded 8004 and PCIe Gen5
April 09, 2026
-
embedded world 2026 Podcast with fidus
April 08, 2026