Embedded Computing Design

Press Releases - Page 3

Industrial
Image Credit: DFI
DFI Announces Cutting-Edge Technologies and the World’s First High-Performance SBC at Embedded World 2023

DFI Inc.

March 18, 2023

Industrial
Twilio Microvisor Simplifies Low-Power IoT Device-to-Cloud Integration with Support for MQTT on FreeRTOS

Twilio

March 8, 2023

Processing
Image Credit: Avalue
Avalue Announces ATX Server Board Based on Latest 4th Generation Intel® Xeon® SP CPU

Avalue Technology Inc.

March 6, 2023

Industrial
Consumers show high interest in solutions that help them better complete everyday tasks and activities
Growing Consumer and Business Interest in the Metaverse Expected to Fuel Trillion Dollar Opportunity for Commerce, Accenture Finds

Accenture

January 4, 2023

IoT
Al Thumama Stadium Introduces MSI FUNTORO Stadium & Arena Solution at FIFA World Cup 2022

MSI AIoT

December 22, 2022

Open Source
Image Provided by the RISC-V in Space Workshop
RISC-V in Space Workshop, 13. December 2022

December 8, 2022

Industrial
Avalue Announces New Industrial Grade PCs Dedicated to AI Applications

Avalue Technology Inc.

December 6, 2022

Security
Win Source Reaffirmed as a Value Component Supplier

Win Source Electronics

November 28, 2022

IoT
ASUS IoT Partners with Media Broadcast for Smart City Solutions

ASUS

November 28, 2022

Healthcare
Avalue Announces Leading-Edge Digital Paper Products

Avalue Technology Inc.

November 22, 2022

Analog & Power
Keysight Licenses Simulation Software Technology to Altium for PCB Design Solutions

Keysight Technologies, Inc.

November 15, 2022

Industrial
Image Courtesy of congatec
congatec Introduces Its Ecosystem for TSN Networked Real-Time Factories and Critical Infrastructures

congatec Inc.

November 15, 2022

Analog & Power
Pasternack Provided the Picture
Pasternack Expands Line of Programmable Attenuators

Pasternack

November 15, 2022

Open Source
ISELED Alliance Welcomes Three New Members

November 15, 2022

Industrial
Image Provided by CEVA, INC.
CEVA, Inc. Announces CEO Transition Plan

CEVA, Inc.

November 15, 2022

Storage
Image Credit: ATP Electronics
Embedded World 2024: High-Endurance, Robust Cross-Temp Reliability 176-Layer Storage, DDR5-5600 Solutions Take Center Stage at ATP Electronics’ Exhibit

April 5, 2024

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Networking & 5G
Fibocom’s 5G Premium Smart Module SC171 Awarded Best in Show by Embedded Computing Design at Embedded World 2024

April 16, 2024

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Open Source
Image Credit: Semidynamics
Semidynamics Drops its All-In-One AI IP On Us

April 11, 2024

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Security
Observability Takes the Stage with New Percepio Solution

April 18, 2024

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