ACM Research Enters Dry Processing Market with Launch of Ultra Furnace
April 28, 2020
News
The Ultra Furnace system is intended for batch processing of up to 100 12-inch (300mm) wafers.
ACM Research, Inc. (ACMR), a supplier of wafer cleaning technologies for advanced semiconductor devices, unveiled the Ultra Furnace, its first system developed for multiple dry processing applications. Designed to deliver high performance for low-pressure chemical vapor deposition (LPCVD), the Ultra Furnace also leverages the same platform to be used for oxidation and annealing processes, as well as for atomic layer deposition (ALD).
The Ultra Furnace system is intended for batch processing of up to 100 12-inch (300mm) wafers. According to the company, the system design combines newly developed hardware that improves durability with the company’s software technology and a proprietary control system and algorithm. This enables the tool to provide stable control of pressure, gas flow rate and temperature.
While the Ultra Furnace system targets LPCVD processes, with a few changes to the components and layout, each tool can address other target applications. According to the company, about 85 percent of the hardware configuration remains unchanged, so the alterations for the new application can be achieved.
For more information, visit: http://www.acmrcsh.com/
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
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Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
