Embedded Computing Design

Christian Eder, Chair of the COM-HPC working group and Director of Market Intelligence at congatec, shares the key innovations in the high-performance Computer-on-Module standard.

Unless developers are true embedded and edge computing experts, evaluating and choosing between the different form factor standards can be pretty hard. Yet, depending on the performance class, there is only one standard that is recommended for new system designs. As always, there are exceptions to this rule.

The PICMG has defined a set of standardized side-band/out-of-band management commands for the recently published COM-HPC Server-on-Module standard. It is called the COM-HPC Platform Management Interface specification, or COM-HPC PMI for short.

For the first time in many years, high-end embedded processors are available on two Computer-on-Module form factor options, COM-HPC^® Client and COM Express^® Type 6.

SMARC 2.0 modules stand out thanks to their large number of graphics, camera, sound, network and optional wireless interfaces.

What the embedded computing industry is preparing for is the next generation of standards for modular system designs. COM-HPC will be THE focus of nearly all embedded computing vendors.

It?s a wonderful gift that the PICMG was brought to us with the approval of the pinout for the new high-performance COM?HPC Computer-on-Module specification.

Scheduled for the first half of 2020, there is still some time to go before the final PICMG ratification of the COM-HPC specification.

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