San Diego, CA 92121 [email protected]
Christian Eder, Chair of the COM-HPC working group and Director of Market Intelligence at congatec, shares the key innovations in the high-performance Computer-on-Module standard.
Deggendorf, Germany. congatec is including the firmware integrated Hypervisor in all new x86 COMs aimed at streamlining real-time virtualization for system consolidation. The solution makes it easier to save money and reduce individual systems while also reducing size, weight, and power (SWaP).
COM-HPC Client Size C high performance module based on 13th Gen Intel®️ Core™️ processor series (code name "Raptor Lake-S")
Unless developers are true embedded and edge computing experts, evaluating and choosing between the different form factor standards can be pretty hard. Yet, depending on the performance class, there is only one standard that is recommended for new system designs. As always, there are exceptions to this rule.
San Diego, CA. congatec will be highlighting its comprehensive COM-HPC ecosystem in hall 3 booth 241 during embedded world 2023. On display will be the COM-HPC Server-on-Modules and ultra-compact COM-HPC Client-on-Modules that around the size of a credit card. The series can easily migrate to the new PICMG standard devoid of significant modification of the internal system and housing.
San Diego, CA. congatec released its HPC/cRLS, socketed COM-HPC Client Computer-on-Modules (CoM). It is centered on 13th Gen. Intel Core processor variants with up to 34% multi-thread and up to 4% single-thread performance. It carries an additional 25% faster image classification inference compacity when juxtaposed with the previous12th Gen Intel Core processors. Further boosts in performance include, USB3.2 Gen 2x2 bandwidth of up to 20 Gigabit per second on the Size C CoM.
San Diego, CA. congatec applauds the approval of the COM Express 3.1 standard and launched 10 compliant Computer-on-Modules powered by 12th Gen Intel Core processors (formerly codenamed Alder Lake). Included in the ratification is a revised 16 Gbps COM Express connector supporting high-speed interfaces like PCIe 4.0 and USB 3.2.