Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

Ken Briodagh interviews Christian Eder & Timo Kuehn with Intel partner congatec live from embedded world 2025.

congatec, an Intel Titanium partner, will be exhibiting its new Computer-on-Modules at embedded world (Hall 3, Booth 241) leveraging the latest Intel technologies from the credit card sized conga-SA8 SMARC module built with low-power Intel Core 3 technology to the high-performing conga-HPC/cBLS COM-HPC Client module utilizing intel Core S processor technology.

San Diego, CA, January 7, 2025 -- congatec expanded its portfolio of high-performance COM-HPC Computer-on-Modules (COMs) with the conga-HPC/cBLS, developed especially for power-hungry edge and infrastructure applications.

congatec will exhibit its extensive range of Computer-on-Modules (CoMs) at embedded world North America (Booth 2223) with innovations that include congatec’s novel aReady. strategy, new Intel Core Ultra processor-based modules with integrated AI, and further premieres based on new low-power high-performing x86 processor technology.

Drones carrying out landscape and agricultural surveillance tasks need to capture massive image data sets for 3D modeling and analysis. The smart binary brains of those drones are more and more often built using off-the-shelf credit card sized Computer-on-Modules, seconded by off-the-shelf standard carrier boards.

With all the buzz around AI and virtualization, especially with the focus on Digital Twin in the embedded systems space, companies are getting loaded up with processing, memory, and applications tailored to deploying these sophisticated modeling and (eventually) predictive AI tools.