San Diego, CA. congatec will be highlighting its comprehensive COM-HPC ecosystem in hall 3 booth 241 during embedded world 2023. On display will be the COM-HPC Server-on-Modules and ultra-compact COM-HPC Client-on-Modules that around the size of a credit card. The series can easily migrate to the new PICMG standard devoid of significant modification of the internal system and housing.

San Diego, CA. congatec released its HPC/cRLS, socketed COM-HPC Client Computer-on-Modules (CoM). It is centered on 13th Gen. Intel Core processor variants with up to 34% multi-thread and up to 4% single-thread performance. It carries an additional 25% faster image classification inference compacity when juxtaposed with the previous12th Gen Intel Core processors. Further boosts in performance include, USB3.2 Gen 2x2 bandwidth of up to 20 Gigabit per second on the Size C CoM.

San Diego, CA. congatec applauds the approval of the COM Express 3.1 standard and launched 10 compliant Computer-on-Modules powered by 12th Gen Intel Core processors (formerly codenamed Alder Lake). Included in the ratification is a revised 16 Gbps COM Express connector supporting high-speed interfaces like PCIe 4.0 and USB 3.2.

Accelerating the real-time digitization

Applications with functional safety (FuSa) require more powerful embedded computing platforms because of the increasingly performance-hungry integrated sensor technology. This is why multicore processors such as the FuSa-qualified Intel Atom processors are so attractive today. They can also be used to consolidate non-critical functions on a single mixed-critical system, which is a major advantage. If there are then also Computer-on-Modules (COMs) that support the FuSa functions of these processors, OEMs benefit from application-ready building blocks that are already fully qualified for the safety certification of their customer applications, and that can be scaled to the required performance. congatec is one of the first companies to manufacture such COMs.

congatec expands its Intel Xeon D-2700 processor-based Server-on-Module portfolio with the introduction of five new modules in the COM-HPC Server Size D performance class (160x160mm).

congatec introduced seven new COM-HPC and COM Express Computer-on-Modules with less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake).