congatec announced its aReady.COM conga-HPC/cRX1, an application ready module powered by up to 16 AMD “Zen 5” CPU cores operating at clock frequencies of up to 5.1 GHz, up to 40 compute units of the integrated AMD Radeon RDNA 3.5 GPU supporting up to four independent 4K displays, and a dedicated NPU.

UltiMaker scaled an entire 3D printing product portfolio to support the performance demands of advanced motion control software thanks to the modular, flexible and upgradable SMARC Computer-on-Module (COM) architecture.

During embedded world Germany, congatec will exhibit its latest innovations in application-ready platforms while located at Hall 3, Booth 241. congatec is "going bigger" following an investment in JUMPtec (the former module business of Kontron AG) that expands its portfolio to even more modules, application examples, and services.

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Ken Briodagh interviews Christian Eder & Timo Kuehn with Intel partner congatec live from embedded world 2025.

congatec, an Intel Titanium partner, will be exhibiting its new Computer-on-Modules at embedded world (Hall 3, Booth 241) leveraging the latest Intel technologies from the credit card sized conga-SA8 SMARC module built with low-power Intel Core 3 technology to the high-performing conga-HPC/cBLS COM-HPC Client module utilizing intel Core S processor technology.

San Diego, CA, January 7, 2025 -- congatec expanded its portfolio of high-performance COM-HPC Computer-on-Modules (COMs) with the conga-HPC/cBLS, developed especially for power-hungry edge and infrastructure applications.