Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

Intel, wolfSSL, Curtiss-Wright, and SYSGO are collaborating to develop next-generation COTS solutions that prioritize safety, security, and innovation in aerospace and industrial industries. By utilizing each company’s strengths, the partnership delivers high performance ruggedized environments that ensure compliance with safety and security standards for mission-critical applications, without requiring specific software, therefore reducing time to market.

San Diego, CA, January 7, 2025 -- congatec expanded its portfolio of high-performance COM-HPC Computer-on-Modules (COMs) with the conga-HPC/cBLS, developed especially for power-hungry edge and infrastructure applications.

AI-powered applications, gaming devices, and other media solutions today must meet the increasing demands for AI acceleration, next-generation connectivity standards, overall efficiency, and low power consumption. To meet these demands, Intel produced the Intel® Core™ Ultra Processors.

Intel and AMD have launched an x86 ecosystem advisory group that the companies say will bring together technology leaders to shape the future of the x86 architecture. They want to show that x86 is able to meet the needs of the market better than other architectures through performance and interoperability across hardware and software.

Altera, an Intel Company, disclosed various FPGA hardware, software, and developmental tools that simplify accessibility across a broad range of use cases. During its annual developer’s conference, Altera discussed new information on its next-generation, power- and cost-optimized Agilex 3 FPGAs and revealed new development kits and software support for its Agilex 5 FPGAs.

On this episode of Embedded Insiders, Jack Weast, Intel Fellow and Vice President and General Manager of Intel Automotive, breaks down the company’s recently announced OLEA U310 SoC. Built with a hybrid and heterogeneous architecture, the solution is designed to improve the overall efficiency of electric vehicles by promoting energy efficiency, and lower design and manufacturing costs.