At this year's embedded world exhibition, Supermicro is proud to announce the launch of its newest range of embedded systems, designed to meet the growing needs of modern industries. From ultra-compact servers to powerful edge AI solutions, Supermicro's latest offerings are set to unlock new, data-driven applications and solutions.

The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the Computer Boards, Systems, Components, & Peripherals category:

Industrial Internet of Things (IoT) applications benefit from dependable and robust solutions, capable of high-performance and processing capabilities at the edge. Applications like these also perform tasks in real-time via IoT devices and sensors that process large amounts of data, further stressing the need for significant computational power, flexibility, and connectivity.

Embedded Computing Design’s Road to Embedded World will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at Embedded World, April 9th to 11th in Nuremberg, Germany. Embedded World is the largest global gathering of its kind. Check back regularly to see where the Road to Embedded World takes us.

San Jose, California. Supermicro, Inc. revealed its E3.S storage solutions leveraging the first PCIe Gen5 drives and CXL modules for AI learning and HPC clusters. The storage utilizes the standard E3.S (7.5mm) Gen 5 NVMe drives from notable vendors with up to 256TB of high throughput, low latency storage in 1U or up to a half petabyte in 2U.

San Jose, California.  Supermicro, Inc. announced its full series of H13 AMD based-systems is now offering support for the 4th Gen AMD EPYC  processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology.

Supermicro's X13 Hyper-E brings top performance and flexibility of Supermicro’s flagship Hyper series to the edge with a dual 4th Gen Intel® Xeon® Scalable Processors (up to 60 cores each) in a short -depth of 574mm (22.6”) 2U design for edge data and telco deployments. The system allows up to 8TB ECC DDR5 DRAM in 32 sockets. 8 PCIe Gen 5 expansion sockets (form 8x8 to 4x16) with three FHHL slots. Connectivity with 10, 25 and 100 Gbe network adapters. 6x 2.5” hot swap NVME drive bay in Raid 0/1/5/10 configuration. Redundant front access 2000W AC or DC power supplies.