On this episode of Embedded Insiders, Paul Fischer, senior principal engineer in the Components Research Department at Intel, discusses the trends and challenges surrounding transistor scaling and backside power. So, ICYMI, these were some of the the top technical research breakthroughs Intel presented this year at IEDM. 

Taipei, Taiwan. ASRock Industrial partnered with Intel and designed FIDO Device Onboarding (FDO)-enabled device series, which for now, includes the iEP-5000G Industrial IoT Controller powered by Intel Atom x6000E Series. The FDO-enabled devices allow users to leverage the complete capability of IoT security through efficient automated onboarding.

Cincoze released its DIAMOND DS-1400 Series of industrial computer modules. The modules are designed for enhanced power while offering PCIe expansion. That power is derived from a 12th gen Intel Alder Lake-S processor with the Intel 7 process, delivering a max out at 16 cores (8P + 8E) with DDR5 memory up to 64GB, 4800MHz, ECC technology.

Having a standard that everyone can design to makes markets take off. Open source, both hardware and software, is nothing new. But when paired with AI, it is relatively new.
 

The combination of Intel and Kontron technologies has introduced revolutionary AI-based visual inspection. 

Moving beyond traditional cameras designed to capture 2D images, today’s cameras are now enhanced with capabilities that enable users to capture images and spaces with three-dimensional technology that can capture the distance and spatial relationships between objects.

Santa Clara, California, and Cambridge, United Kingdom. A multigeneration union between Intel Foundry Services (IFS) and Arm will see low power SoCs based on the Intel 18A process. The companies see the future as expanding to applications involving Internet of Things (IoT), automotive, aerospace, and data centers.