Encryption is central to helping today’s organizations protect the privacy of their sensitive data and comply with regulations.

Video processing, communication, and machine learning inferencing applications are often deployed across a range of industries and tasked with managing edge computing workloads requiring large memories, DSP resources, and a variety of high bandwidth interfaces. To support these applications, a next-generation small FPGA platform offers reconfigurability, high performance, and the ability to integrate advanced resources in a compact form factor.

Hillsboro, Oregon. Lattice Semiconductor added its logic-optimized Lattice Certus-NX FPGA devices to its FPGA portfolio. The Certus-NX-28 and Certus-NX-09 support power efficiency, small size, and adaptable migration preferences. The solutions are built on the Lattice Nexus FPGA platform.

HILLSBORO, Ore.--(BUSINESS WIRE)--Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced its exhibition plan for embedded world 2024. Lattice technology will be on full display throughout the tradeshow with conference sessions on embedded vision, AI, security and functional safety, and connectivity, in addition to a demo-filled booth display. Joined by a strong lineup of innovation partners, Lattice will showcase its latest advancements in FPGA solutions that enable engineers to future-proof their designs for Automotive, Industrial, and Security applications at the Edge.

The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the Microcontrollers, Microprocessors, & IP category:

In today's rapidly evolving technological landscape, the Automotive, Communications, and Industrial markets stand at the forefront of digital transformation. Advanced technologies powered by artificial intelligence (AI) and machine learning (ML) have ushered in a new era of innovation, where technologically advanced vehicles redefine driving experiences, 5G connectivity enables unparalleled processing speeds, and smart manufacturing facilities revolutionize industrial workflows with automation.

On this episode of Embedded Insiders, Paul Fischer, senior principal engineer in the Components Research Department at Intel, discusses the trends and challenges surrounding transistor scaling and backside power. So, ICYMI, these were some of the the top technical research breakthroughs Intel presented this year at IEDM.