Embedded Computing Design

TE Connectivity's DEUTSCH DMC-MD Cable Clamps Offer Connectivity in Aerospace Applications

HCC Embedded recently added support for the Xilinx Zynq-7000 All Programmable system-on-chip (SoC) devices to its middleware suite. Developers using the Zynq-7000 SoCs now have access to HCC’s entire suite of advanced flash storage and communications middleware. Solutions include fail-safe flash file systems; MISRA-compliant TCP/IP, TLS, and encryption; and USB with network integration, fail-safe bootloaders, and integration services.

Connext DDS 5.3 leveraged the layered databus pattern identified in the Industrial Internet Consortium?s (IIC?s) Industrial Internet Reference Architecture (IIRA).

MEN presents the latest member of its CompactPCI Intel CPU product family, which has been growing for more than eleven years now. The F26L is based on Intel's latest Apollo Lake-I platform with...

BrainChip has released the BrainChip Accelerator, an 8-lane PCIe expansion board that is capable of delivering a 6x increase in the speed and accuracy of object recognition functions in BrainChip Studio software. In tandem, the BrainChip accelerator supports 16 simultaneous video channels per card, and can be deployed in existing video surveillance systems without requiring updated power supplies or thermal management equipment.

Mobiveil, Inc. and Crossbar, Inc. have partnered to apply Mobiveil’s PCIe to NVMe solid state drive (SDD) IP to Crossbar ReRAM IP blocks. The companies are collaborating on a ReRAM-based SSD design that will support 512-bit I/O operations per second at below 10 µs latency, allowing the solution to provide faster access times for frequently accessed data center information.

congatec’s multicore conga-B7AC COM Express Type 7 server on modules are based on the Intel Atom C3000 (Denverton) processor, and consume as little as 11 W. The processor modules provide up to 4 x 10 GbE interfaces; 20 PCIe lanes (12x PCIe Gen 3.0, 8x PCIe Gen 2.0); are deployable in -40 ºC to +85 ºC operating ranges; and support up to 16 cores.

September 12th, 2017, as an independent embedded computer manufacturer, LinkedHope launched a China local-designed, local-manufactured 6U VPX switch board, named VP68802.

Semantic interoperability relies on a designated ontology to interpret meaning (context) of exchanged data and apply it to valuable ends. This can span multiple systems, environments, and industries.

Press release for Orion Technologies awards ranking on the Inc 5000 list.

The global electric vehicle charging market is expected to showcase an exponential CAGR of 30.8% between 2017 and 2025. At this pace, the market's valuation will reach US$37.48 bn by the end of 2025.

EEMBC has released the ULPMark-PP benchmark for measuring the energy efficiency of microcontrollers and their programmable peripherals.

Where security matters, a fiber-optic connection excels. Fiber-optic cables have no electromagnetic signature, making them very difficult to tap compared to wired connections.

The module offers adjustable output voltages from 0.6 to 12 V, and provides a power density of 60 mA/mm2 in a 13- by 19 mm package.

As stated by Power Integrations? Mr. Green, the proposed eligibility requirements for the 2018 Energy Star Most Efficient program are now available for review.

iWave is a leading FPGA design house with an extensive variety of FPGA IP Cores. iWave redesigns all IP Portfolios consistently to meet the market demands. One of the most pre-dominant being ARINC...

STMicroelectronics continues to push the envelope of 8-bit microcontrollers (MCUs), this time saving cost by going to an SO-8 package with its STM8S001 MCU.

Previously, docking connectors only featured ?plugged in? and ?not plugged in? states. Now, three different states are possible.

MediaTek has adopted Imagination Technologies’ MIPS I-class CPU in the Cat-10 LTE modem of its Helio X30 smartphone chipset. The multithreading capability of the MIPS I-class CPU helps the Helio X30 4G LTE-Advanced modem support 450 Mbps download speeds and 150 Mbps upload speeds, while achieving balanced power, performance, costs, and real-time responsiveness for simultaneous latency-sensitive tasks.

NeuroMem Technologies has launched the NeuroTile “mobile AI” module for wearables and robotics. NeuroTile is packaged with Arduino IDE code, and is pin-compatible with Intel Curie modules. It combines a low-power STM32 microcontroller, Lattice FPGA, an NM500 neuromorphic chip on a 35 mm x 26 mm board. An additional STM32 microcontroller delivers extended software capabilities and Bluetooth Low Energy (BLE) support.