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Is it cost-effective to deploy Computer-on-Modules (COMs) in products that are manufactured in million-unit quantities? Many would instinctively respond with a resounding "No," citing the prohibitive costs.

The OSM (Open Standard Module) specification, officially adopted by the SGET (Standardization Group for Embedded Technologies e.V.) in 2021, heralded the world’s first manufacturer-independent standard for solderable Computer-on-Modules. This is now being followed by a second wave of standardization as OEMs seek to switch from proprietary solutions to a unified standard across the entire range of ultra-low-power application processors.