Connectivity is a simple word for something that is often anything but simple. It’s the key to the thousands of concepts for wearables, automobiles and logistics solutions in the expanding universe of the ‘Internet of Things’ (IoT). For systems builders, the choice of connectivity technology will have a significant impact on availability, reliability, user experience and, ultimately, the success of the solution. Low-Power Wide-Area Network (LPWAN) technologies offer a broad range of solutions, from short-range in-building to nationwide solutions although with limitations. However, it is cellular wireless, under the umbrella of the 3rd Generation Partnership Project (3GPP), that offers true worldwide connectivity.

We spend a lot of time talking about the specification known as CHIP (Connected Home over IP). While the hard work on this topic continues, the names of the group and the standard have changed.

Infineon Technologies announced the release of ModusToolbox Machine Learning (ML).

Infineon Technologies AG together with Reality AI created an advanced sensing solution giving vehicles the sense of hearing

IAR Systems presented a complete set of development tools for the TraveoTM II family of microcontrollers (MCUs) from Infineon, bringing a solution with AUTOSAR support to companies working with automotive body electronics applications.

Infineon Technologies AG introduced a new automotive power module with CoolSiC MOSFET technology.

Eurotech announced it is collaborating with Infineon, Microsoft, and GlobalSign to develop a solution that will simplify large scale, secure rollouts of connected devices.