Q1 FY 2020: revenue decline as predicted, Segment Result Margin developed positively, cost-reduction measures taking effect, outlook for 2020 fiscal year confirmed.

The higher power density enables a significantly smaller footprint than conventional package technologies.

Highly-integrated processors are needed to support the advanced functionalities a next-generation vehicle must deliver

USB-PD is made possible by the universal USB-C connector, and the next development stage will be permanently installed USB-PD wall outlets.

The REAL3 single-chip solution measures 4.4 x 5.1 mm, and offers high-resolution data with low power consumption.

The power modules feature a maximum allowed overload junction temperature of 175?C.

From January 2020, Bernd Hops (46), currently Head of External Communications, will take over as Head of Communications and Public Authorities & Associations at Infineon Technologies AG.