Embedded Computing Design

u-blox and NetModule announced their partnership in the development of modular, multifunctional automotive gateways for telematics applications.

The Optoelectronics group of Vishay Intertechnology introduced two new fully integrated automotive grade proximity sensors with resolution up to 20 µm for force sensing applications.

Prodigy Technovations announced an innovative Logic Analyzer for Embedded Interfaces to address the design verification, validation, and testing challenges faced by embedded design teams.

New development toolsuite provides consistency across guest operating systems and is designed to enhance project productivity.

High-speed interfaces and provisions that allow modules to host PCIe targets mean that COM-HPC can support compute architectures ranging from Arm to GPUs to FPGAs and more.

New evaluation kit simplifies evaluation of Renesas’ R-IN32M4-CL3 IC for industrial Ethernet communication with CC-Link IE TSN.

Macnica ATD Europe announced its parent company, Macnica, is now offering Macnica SLVS-EC IP versions for both Intel and Xilinx devices.

Vishay Intertechnology released a new series of automotive-grade miniature aluminum electrolytic capacitors that couple high ripple currents up to 3.8A with temperature operations up to +105 °C.

PRBX announced the release of the ENR500D, a 500W platform designed to comply with the EN 50124-1 standard and for the Pollution Degree 2 (PD2).

“oneM2M is bringing together the IoT community to promote global standards and provide a platform that will enable collaboration without borders,” said Laurent Velez, Technical Officer at oneM2M.

Xilinx announced a collaboration with Texas Instruments (TI) to develop digital front-end (DFE) solutions in an effort to increase energy efficiency of lower antenna count radios.

Companies like Semtech collaborate with RF component manufacturers willing to develop miniaturized front-end RF solutions specifically designed to seamlessly connect with Semtech’s LoRa® Chipsets.

Western Digital (NASDAQ: WDC) today announced a suite of new NVMe SSDs for enabling next-generation, data-centric architectures for data centers, industrial IoT, automotive and client applications.

EdgeQ Announced its launch from stealth with $51 million in total funding, including $38.5 million in a Series A round.

Reference Design Combines OmniVision’s Dual-Mode Global Shutter Image Sensor for Both RGB and IR Imaging With Ambarella’s AI Vision Processor and Smart Eye’s AI DMS Software Algorithm

The newest member of the Digi IX industrial cellular router family, can operate well with digital signage, asset monitoring, and retail applications

ROHM has announced the development of a new family of four AEC-Q100 qualified high side switch ICs targeting the automotive market.

QuickLogic announced it has joined the Samsung Advanced Foundry Ecosystem (SAFE) as its newest member of the IP Partner Program.

PREEvision 9.5.4 from Vector allows wiring harness designers and architects to get views on the data they are working on with an intelligent auto-layout algorithm.

Semiconductors aimed at the automotive and inductrial sectors have been coming at us at a fast and furious pace.