Embedded Computing Design

Semiconductors aimed at the automotive and inductrial sectors have been coming at us at a fast and furious pace.

ADLINK Technology is an official sponsor of the Indy Autonomous Challenge (IAC), scheduled for October 23, 2021.

Winbond Electronics Corporation announced that its W75F Secure Flash memory device with Common Criteria EAL5+ certificate, has achieved the ISO26262 ASIL Grade D safety certification.

Results Highlight “Zero Effort” Architecture Benefits for Computing Neural Networks.

With reliability as a key influence on both partners, this collaboration allows for mission-critical device manufacturers with first-class safety, reduced R&D costs, and faster time to production.

Test and measurement specialist Rohde & Schwarz extends its support to the University of New Hampshire Interoperability Laboratory (UNH-IOL) with an extension to their compliance test services.

Microchip’s new TrustAnchor device provides OEMs and their module suppliers with a simplified path to automotive network security, reducing costs and time to market.

Reference Design with SMARC 2.0 Form Factor Offers Choice of Three RZ/G2 MPUs for Scalable Performance in AI IoT Face/Object Detection & Image Processing Applications

AMD launched a new product in its Embedded processor family, the AMD Ryzen Embedded V2000 Series processor.

With today’s IoT networks getting bigger than ever, many businesses and tech practitioners are discussing the possibility of implementing global IoT connectivity to scale the IoT network globally.

Numenta announced it has achieved ideal performance improvements on inference tasks in deep learning networks, per the company, without any loss in accuracy.

Entire Fleet to Feature Software-Defined and Perpetually Updateable AI User Experiences Starting in 2022.

The switching stage of the new PRBX ENR500D is based on a resonant topology, per the company, providing a high efficiency of 95% typical across the low to high load range.

Per the company, joining with SmartWave Technologies, the new MultiTech is now in a position to grow the market size of connected IoT devices and accelerate OEM and enterprise digitization.

All five COM-HPC module standards (A ~ E) will utilize 800 pins via two new high-speed connectors with at least 4 x 100 pins each and 2 x 400-pin board –to-board connectors.

Application Developers Can Now Leverage Connext DDS Scalability and Productivity Tools With the ROS 2 Ecosystem.

Green Hills to Offer Sectigo Embedded Firewall Products, Integrated and Optimized with Its Portfolio of Internet-Connected Platform Solutions.

Toradex supports the design and development of secure, mission-critical embedded solutions using BlackBerry QNX.

Combined with LG's visualization technologies the result was a modern AR solution supporting intuitive AR scenes like navigational hints (route carpets, directional arrows, goal pins, POI highlights)

The Litemax 2.5" Pico-ITX Boards are compact Embedded Boards in the size of 100x72mm, it creates and fulfills various space-constrained applications.