KIOXIA
KIOXIA Advances Development of UFS Ver. 3.1 Embedded Flash Memory Devices with QLC-Technology - Press Release
January 27, 2022Düsseldorf, Germany, 19 January 2022 – KIOXIA Europe GmbH a world leader in memory solutions, today announced the launch of Universal Flash Storage (UFS) Ver. 3.1[1] embedded flash memory devices utilizing the company’s innovative 4-bit per cell quad-level-cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, KIOXIA’s QLC technology enables the capability to achieve the highest densities available in a single package.
KIOXIA Announces Ver 3.1 UFS Embedded Flash Memory Devices - News
August 11, 2021Built on the latest generation BiCS FLASH™ 3D Flash Memory, Ver. 3.1 brings a thinner profile and faster read and write speeds to applications.
Why TLC 3D BiCS FLASH Outperforms 2D MLC Flash Technology - Product
May 10, 2021One of the most critical elements of any embedded application is its memory.
KIOXIA Introduces World’s Thinnest 1TB Ver 3.1 UFS Embedded Flash Memory Device - News
March 11, 2021Designed to Meet the Demands of High-End 5G Smartphones and Other Data-Intensive, Demanding Mobile Applications.
KIOXIA Introduces World’s Thinnest 1TB Ver 3.1 UFS Embedded Flash Memory Device - Press Release
March 04, 2021Designed to Meet the Demands of High-End 5G Smartphones; Other Data-Intensive, Demanding Mobile Applications.
Embedded Computing Design's Best in Show at the First All-Digital embedded world - Story
March 02, 2021Embedded Computing Design is pleased to announce all 12 winners, across six categories, of this year's Best in Show at the embedded world trade show. The show, which is normally hosted in Nuremberg, Germany, is all-digital this year.
KIOXIA Automotive e-MMC: Ultra-Reliable High-Density Memory Ready for Life on the Road - Product
March 01, 2021Today’s car makers are under pressure to deliver vehicles that are safer, smarter, and cleaner.