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KIOXIA Advances Development of UFS Ver. 3.1 Embedded Flash Memory Devices with QLC Technology - NewsJanuary 28, 2022
KIOXIA America, Inc. announced the launch of its Universal Flash Storage (UFS)* Ver. 3.1 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.
KIOXIA Advances Development of UFS Ver. 3.1 Embedded Flash Memory Devices with QLC-Technology - Press ReleaseJanuary 27, 2022
Düsseldorf, Germany, 19 January 2022 – KIOXIA Europe GmbH a world leader in memory solutions, today announced the launch of Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices utilizing the company’s innovative 4-bit per cell quad-level-cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, KIOXIA’s QLC technology enables the capability to achieve the highest densities available in a single package.
Built on the latest generation BiCS FLASH™ 3D Flash Memory, Ver. 3.1 brings a thinner profile and faster read and write speeds to applications.
One of the most critical elements of any embedded application is its memory.
Designed to Meet the Demands of High-End 5G Smartphones and Other Data-Intensive, Demanding Mobile Applications.
Designed to Meet the Demands of High-End 5G Smartphones; Other Data-Intensive, Demanding Mobile Applications.
Embedded Computing Design is pleased to announce all 12 winners, across six categories, of this year's Best in Show at the embedded world trade show. The show, which is normally hosted in Nuremberg, Germany, is all-digital this year.