STMicroelectroncs' STEVAL-ASTRA1B multi-connectivity evaluation platform is a complete, small form factor, battery-powered ecosystem for building complete proof-of-concept for asset tracking systems. This evaluation kit's included firmware simplifies development-targeted applications like fleet management and logistics.
The MIPI Alliance, an international mobile interface specifications organization, updated its application-agnostic MIPI UniPro transport layer for chip-to-chip/interprocessor communication (IPC) applications in traditional and modular device architectures. Version 2.0 includes features that double the data rate, while improving throughput and decreasing latency.
Spirent Communications plc, a provider of test and assurance solutions for next-generation devices and networks, launched a “Send Us Your Device” Test as a Service (TaaS) option for Wi-Fi customers.
STMicroelectronics, a global semiconductor company, released version 4.20 of its TouchGFX user interface design software for STM32 microcontrollers. Updates in this version enable support for the company's NeoChrom graphics accelerator, integrated in ST's advanced MCUs.
The Industry IoT Consortium® (IIC™) published an update to its Industrial Internet Networking Framework (IINF), a guide to help IIoT application developers design, deploy, and operate successful networking solutions.
Semtech Corporation, a global supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, and Sierra Wireless, Inc., an Internet of Things (IoT) solutions provider, announced a definitive agreement under which Semtech will acquire all outstanding shares of Sierra Wireless for US$31 per share in an all-cash transaction representing a total enterprise value of approximately US$1.2 billion, subject to customary closing conditions.
Industry 4.0 is the inevitable next step for manufacturing facilities. However, making that transition is not a simple flip of a switch.
IoT company Telit and Aerospace, Defense, Security & Digital Identity company Thales announced they have entered into an agreement under which Telit intends to acquire Thales’ cellular IoT products. The intended transaction includes Thales’ portfolio of cellular wireless communication modules, gateways, and data (modem) cards, ranging from 4G LTE, LPWAN to 5G.
The Metaverse Standards Forum brings together leading standards organizations and companies for industry-wide cooperation on interoperability standards needed to build the open metaverse. The Forum will explore where the lack of interoperability is holding back metaverse deployment and how the work of Standards Developing Organizations (SDOs) defining and evolving needed standards may be coordinated and accelerated.
Altair, a computational science and artificial intelligence (AI) company, recently signed a memorandum of understanding with LG Electronics (LG) to accelerate the digital transformation of product development.
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation ultra-wideband (UWB), and UWB Alliance, an international non-profit organization dedicated to the promotion and growth of the UWB industry, have initiated a joint effort to test the coexistence and aggregation capabilities of UWB technology in environments where other UWB or other wireless protocols and radio devices are in use.
Global ubiquity and prominence in delivering the internet make Wi-Fi® a suitable choice for connecting Internet of Things (IoT) devices in both residential and industrial environments. Wi-Fi is suited to support IoT products and applications with its ranging capabilities and proliferation as a global standard. Wi-Fi will play a role in almost every IoT environment, either alone or alongside more specialized protocols or technologies.
Global Total Semiconductor Equipment Sales On Track to Record $118 Billion in 2022, SEMI Reports - NewsJuly 14, 2022
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a record $117.5 billion in 2022, rising 14.7% from the previous industry high of $102.5 billion in 2021, and increase to $120.8 billion in 2023, SEMI announced in releasing its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON West 2022 Hybrid.
Yole Intelligence’s imaging team has released its annual report, 3D Imaging and Sensing, which provides a comprehensive and up-to-date description and analysis of the ecosystem. It highlights the market dynamics and technological evolution and provides insights into the constraints and challenges of the 3D imaging and sensing industry.
Responsible Computing is a systemic approach aimed at addressing current and future challenges in computing, including sustainability, ethics, and professionalism, stemming from the belief that we need to start thinking about technology in terms of its impact on people and the planet.
GaN Systems and PowerSphyr Advance Partnership to Deliver Comprehensive Wireless Power Solutions - NewsJuly 08, 2022
GaN Systems, a global supplier of GaN (gallium nitride) power semiconductors, and PowerSphyr Inc., a wireless energy company, has collaborated to deliver a portfolio of end-to-end wireless power solutions (30-Watt, 100-Watt, and 500-Watt) for industrial and automotive applications. The new portfolio, combined with enhanced levels of customer service and support, helps industrial and automotive customers obtain compact, high-performance, low-cos wireless power solutions.
Ambiq®, an ultra-low-power semiconductor solutions company based on the proprietary and patented Subthreshold Power Optimized Technology (SPOT®) platform, announced the general availability of Apollo4 Blue Plus supporting Bluetooth Low Energy connectivity, enhanced graphics display, and audio capabilities, and flexible security features to safely deploy power-constrained IoT endpoint devices without compromising power efficiency.
Keysight Launches New Design and Simulation Software for Radio Frequency and Microwave Designers - NewsJuly 05, 2022
Keysight Technologies, Inc., a technology company that delivers advanced design and validation solutions, has introduced the PathWave Advanced Design System (ADS) 2023, an integrated design and simulation software that rapidly addresses increasing design complexity and higher frequencies in the radio frequency (RF) and microwave industry.
Renesas and Cyberon Partner to Deliver Integrated Voice User Interface Solutions for Renesas RA MCUs Supporting Over 40 Global Languages - NewsJuly 05, 2022
Renesas RA customers will now have complimentary access to Cyberon’s continuous command-based VUI toolchain, enabling them to add voice-recognition to a variety of endpoint applications in home appliances, building automation, industrial automation, wearables, and more.
Renesas Electronics Corporation's SmartBond™ DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE connectivity into a single chip. This combined functionality provides smart IoT devices with advanced sensor and graphical capabilities and ultra-low-power, always-on audio processing.