Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

MINNEAPOLIS— Perforce Software is partnering with Siemens Digital Industries Software to transform how smart, connected products are designed and developed, reflecting a shared vision: the future of product innovation is software-defined, AI-powered, and silicon-enabled.

TSMC, Cadence, KLA, Siemens, and Synopsys are advancing semiconductor manufacturing by adopting the NVIDIA CUDA-X and NVIDIA Blackwell platforms.  

Chip design has always been a complex process, and there is no end in sight. What has improved are the tools available to an IC designer. The chips are getting more specialized; hence, the tools must drill down further into the process than ever before. 

This sounds like a lot of black magic, but it becomes less cloudy when someone who understands the process walks you through it. To get more clarity for myself, I invited Scot Morrison, the Vice President of Shift Left Software Product Management at Siemens EDA, to be my guest on this week’s Embedded Executives podcast. Scott first lays out the problems, then walks through some of the various solutions.

It’s only about a month out from CES and we’re already seeing the impacts of some of the news that was dropped in Las Vegas at the biggest show in consumer electronics.

Cognizant announced today a new collaboration with Siemens Digital Industries Software to integrate Siemens' PAVE360™ into its software-defined vehicle (SDV) solution accelerator. The Cognizant solution accelerator aims to address resource and complexity challenges by enabling continuous and simulated verification and validation across vehicle development.

Because of the ever-increasing power density in today's electronics thanks to the miniaturization of semiconductor packages and electronic systems and trends for thin-form consumer products, today’s electronics often have heat dissipation challenges that need to be resolved during design.