Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology - NewsJanuary 21, 2021
Siemens announced that its tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.
Beckhoff Announces MindSphere is the Latest to be Integrated with TwinCAT IoT Family - Press ReleaseDecember 10, 2020
Beckhoff announced that MindSphere, an Industrial IoT as a service solution from Siemens is the latest solution that can integrate with TwinCAT.
Internet of things (IoT) devices have become the largest driver of semiconductor revenue, with wireless communication, automotive, and artificial intelligence products following in short order.
AI is not only used for path planning and obstacle avoidance, but incorporated in every step of development from modeling how systems will perform on the road to gathering parts for manufacturing.
Siemens announced it has acquired UltraSoC Technologies, a Cambridge, UK-based provider of instrumentation and analytics solutions.
Using Siemens PAVE360 with Arm automotive IP, automakers and suppliers can simulate and verify sub-system and system on chip (SoC) designs.
Increasingly, embedded software developers are realizing that dynamic memory allocation is fraught with problems.