Siemens Extends Support of Multiple IC Design Solutions for Samsung Foundry’s Latest Process Technologies - NewsNovember 29, 2021
Siemens Digital Industries Software announced it has enabled several of its electronic design automation (EDA) product families for the latest versions of Samsung Foundry’s advanced processes, including Siemens’ solutions targeting advanced packaging, electrostatic discharge (ESD) rules, and integrated circuit (IC) design in the cloud.
Siemens Introduces mPower Power Integrity Solution for Analog, Digital, and Mixed-Signal IC Designs - NewsSeptember 28, 2021
According to Siemens Digital Industries Software, the new software is the industry’s first and only IC power integrity verification solution designed to provide virtually unlimited scalability for analog, digital, and mixed signal ICs.
Ensuring the success of your RISC-V product with a commercial-grade software development ecosystem - WhitepaperSeptember 15, 2021
The headlines continue to grow as more companies move their embedded projects to the RISC-V platform.
To achieve this latest certification, the Aprisa tool passed a suite of rigorous tests that confirmed the Siemens place-and-route software supports 22FDX design features. GF’s 22FDX platform is suitable for high-volume devices that require minimal idle power and low leakage, at design costs in line with those of 28nm chips.
On this episode of Embedded Insiders, Brandon and Rich discuss the global chip shortage and the difference between price gouging, tough luck, and a need for innovation.
Many products rely on sophisticated electrical/electronic (E/E) systems to deliver their end user functionality.
Siemens announced that its collaboration with foundry partner TSMC has resulted in the certification of its Aprisa place-and-route solution for TSMC’s advanced N6 process.