Siemens announced that its collaboration with foundry partner TSMC has resulted in the certification of its Aprisa place-and-route solution for TSMC’s advanced N6 process.

Siemens introduced PCBflow, a cloud-based software solution designed to bridge the gap between the electronics design and manufacturing ecosystems.

Cybersecurity firm Dragos recently released its annual Industrial Control Systems Cybersecurity Year in Review Report for 2020, which shows that threats targeting ICS and OT infrastructure tripled last year. The 703 identified vulnerabilities were underscored by the company’s findings that roughly 90 percent of its clients had little to no visibility into their ICS environments beyond the IT/OT network boundary.

During a recorded presentation from  embedded world 2021, Rich and Brandon are joined by Technology Editor Curt Schwaderer, who doubles as Vice President of Engineering at intelligence and security provider Yaana Technologies. The three discuss how the tech industry in particular and connected organizations in general have transitioned from protecting devices from attacks to accepting they will be hacked and mitigating losses to modern threat intelligence and modeling strategies. They then look at this evolution through the lens of employees, who are handling and working with sensitive information and IP, working from home.

With the scramble to secure efficient and renewable energy sourced power and electricity requirements, industry giants are expected to leverage three prominent approaches to streamline distribution capabilities: accelerating carbon neutral delivery; augmenting virtual reality capacities and striving for democratic; and decentralized business models

Siemens announced that its verification of AMS circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.

Siemens announced that its tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.