Soracom, Inc., a global provider of advanced IoT connectivity, has entered an agreement with Orange Wholesale France to expand its network for IoT connectivity around the world.
Long-Term Continuation of the PC/104 SBC: The VDX3-6755 Supports Full ISA, CAN Bus, Dual LAN, and Isolated Ios - NewsMarch 23, 2022
The VDX3-6755 family of boards implement the DM&P dual-core Vortex86 DX3 processor with the rugged PC/104 form factor to promote a single board computer that natively supports full ISA and is a replacement option for many legacy x86 architecture CPU boards facing EOL.
Connected device observability and diagnostics platform provider Memfault was selected to participate in the 5G Open Innovation Lab (5GOIL or 5G OI Lab). Memfault joins 11 other multistage startups participating in the fifth batch of the 12-week program.
Siemens Digital Industries Software announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology.
Variscite, a System-on-Module designer and manufacturer, launched a new production line that increased in-house manufacturing capabilities at its production and warehouse facilities to help bypass the component crisis due to the impact of COVID and supply chain challenges.
Semtech Corporation, a supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, announced March 2022 production of its Tri-Edge™ clock and data recovery (CDR) with an integrated DML driver to enable emerging 50Gbps PAM4 5G front haul deployments, the GN2255.
Ambiq Enables Intelligence on Endpoints with a Broadened Portfolio of Ultra-Low Power Processors - NewsMarch 15, 2022
Ambiq® introduced an expanded Apollo4 SoC portfolio, including the latest Apollo4 Plus and Apollo4 Blue Plus with Bluetooth Low Energy connectivity with enhanced graphics display capabilities and more robust security features to protect power-constrained IoT endpoint devices without compromising power efficiency.
Success Story: How an Industry Collab Helped the World Wildlife Fund Upgrade Polar Bear Tracking Tags - StoryMarch 11, 2022
Learn how MistyWest, a sustainability-centric design engineering firm out of Vancouver, British Columbia helped the World Wildlife Fund transform the state of the art in wild polar bear tracking.
Industry 4.0 has been in the works for more than a decade but is finally reaching critical mass. As OT professionals prepare to safely and securely ramp up industrial digitization initiatives, there are a range of new, probably unfamiliar technologies they must become acquainted with to have a shot at success.
Here are the top three.
Wi-Fi 6 is on the cusp of mass global adoption and is on track to displace Wi-Fi 5 (i.e., IEEE 802.11ac) by 2023 as the dominant form of consumer Wi-Fi. ABI Research forecasts more than 1 billion consumer, enterprise and carrier Wi-Fi access points to ship between 2022 and 2026, the vast majority of which will be based on the Wi-Fi 6/6E standards.
Together, the two companies will build 5G-ready solutions to expand the diversity of commercially available O-RUs and facilitate the growth of Open RAN networks. As a part of this collaboration, STL and Analog Devices will work closely with other ecosystem providers, including power amplifier vendors, to expand the range of STL's Garuda O-RU indoor small cell offerings.
Renesas Pioneers RISC-V Technology With RZ/Five General-Purpose MPUs Based on 64-Bit RISC-V CPU Core - NewsMarch 03, 2022
Renesas Electronics Corporation's RZ/Five employs the Andes AX45MP, based on the RISC-V CPU instruction set architecture (ISA). The RZ/Five augments Renesas’ previously available Arm® CPU core-based MPUs, expanding customer options and providing more flexibility in the product development process.
Without plastics we wouldn’t have computers, televisions, smartphones, or even electronic components that are manufactured using resins of the material. And that’s just the technology sector.
The telecommunications industry’s growing open ecosystem gives CSPs more choice in their technologies and partners as they modernize to cloud-native networks. CSPs need the various technologies of this open ecosystem to work together to offer differentiated edge services and reduce costs.
Telit announced two additional modules based on the Qualcomm 9207 LTE IoT modem — the LE910C1-WWX and LE910C4-WWX — for its LTE IoT portfolio to enable single-SKU global deployments. The new LTE Cat1 and Cat4 modules complete the Telit LE910C1 and LE910C4 families.
Inova Semiconductors released their INAP566TAQ and INAP596TAQ transmitter ICs; two new members of the APIX3 SerDes product family. APIX (Automotive Pixel Link) is a multi-channel SerDes (Serializer/Deserializer) technology developed by Inova for automotive high-resolution video applications.
Worldwide silicon wafer area shipments in 2021 increased 14% while wafer revenue rose 13% compared to 2020, topping $12 billion to reach new all-time highs, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.
ioXt Alliance, the global standard for IoT security, announced that it is expanding its ioXt Certification Program with a new profile for Network Lighting Controls (NLC), allowing manufacturers to certify commercial lighting systems with wirelessly connected parts.
NVIDIA and SoftBank Group Corp. (SBG or SoftBank) announced the termination of the transaction whereby NVIDIA would acquire Arm Limited (“Arm”) from SBG. The parties agreed to terminate the Agreement because of significant regulatory challenges preventing the consummation of the transaction, despite good faith efforts by the parties.
SiTime Corporation's XCalibur™ active resonator product category solves supply chain constraints using programmable semiconductors to deliver a drop-in replacement for quartz crystal resonators. XCalibur provides higher performance and reliability while reducing development time by up to two months in automotive, enterprise, and industrial applications.