Embedded Computing Design

The solution leverages the smaller size, lower cost, and increased efficiency associated with iSIM technology, combined with an advanced LPWA chipset for NB-IoT, CAT-M, and local breakouts — all contributing to improving latency and extending battery life.

Global fab equipment spending for front end facilities is expected to rise 10% year-over-year (YOY) in 2022 to a new all-time high of over US$98 billion, marking a third consecutive year of growth, SEMI highlighted in its quarterly World Fab Forecast report.

Skkynet Cloud Systems, Inc. announced the release of a new version of DataHub® middleware. With new enhancements, DataHub middleware for secure, real-time industrial data communications now connects to popular industrial data historians from AVEVA, InfluxData, and OSIsoft. This release can handle thousands of MQTT connections, including MQTT Sparkplug B.

Global technology intelligence firm ABI Research has been actively monitoring the activities of 52 IoT cellular module vendors for the previous two years, collating information about their module portfolios into a single central repository, to offer a thorough overview of all that is available.

EMA Design Automation, a provider of Electronic Design Automation (EDA) systems solutions, announced it is expanding with the merger of EMA and FlowCAD, the leading EDA solutions provider in Central Europe for over 18 years. This announcement marks EMA's fourth such expansion in 18 months. 

Rohde & Schwarz has upgraded the R&S CMP200 radio communication tester with a new option for small cell testing. Qualcomm Technologies has validated the solution, and it is now supported by the Qualcomm® Development Acceleration Resource Toolkit (QDART) for Small Cells.

CEVA, Inc., a licensor of wireless connectivity, smart sensing technologies, and integrated IP solutions, announced that its RivieraWaves Bluetooth® Dual Mode 5.3 Platform has achieved Bluetooth SIG Qualification, along with its GAF (Generic Audio Framework) and LC3 codec.

The AIROC CYW20829 Bluetooth LE SoC is a Bluetooth 5.3 core spec-compliant device with a combination of low power and high performance, designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases for home automation, sensors, lighting, Bluetooth Mesh, remote controls, and any other Bluetooth LE-connected IoT application.

In its whitepaper, "70 Technology Trends That Will—and Will Not—Shape 2022," ABI Research analysts identify 35 trends that will shape the technology market and 35 others that, although attracting speculation and commentary, are less likely to move the needle. Read on to learn the predicted future of Ultra-Wideband and 5G positioning.

Taiwanese deep tech and hyper-scale computing developer Avalanche Computing is launching its software-as-a-service (SaaS) artificial intelligence tool, hAIsten AI, on the global stage at CES 2022 in Las Vegas. With hAIsten AI, they will demonstrate how to train AI models using multiGPUs without coding and deploy AI with a single click.

CY Vision, maker of holographic display technologies for AR experiences, will debut the company's automotive 3D Augmented Reality Head-Up Displays (3D AR-HUD) at CES 2022. The only augmented reality windshield technology on the market able to provide continuous depth and true 3D capability, 3D AR-HUD provides the widest field of view in augmented displays on the market for all distances and all weather conditions.

Panasonic, in collaboration with Tropos Motors, a supplier of eLSVs (Electric Low Speed Vehicles), announced the integration of the Panasonic OneConnect vehicle monitoring and management platform into production orders of the Tropos Motors ABLE platform in North America and Europe in early 2022.

Lattice Semiconductor Corporation announced that its Lattice CrossLink™-NX FPGAs and AI-optimized software solutions power Lenovo’s latest ThinkPad X1 portfolio. The Lenovo ThinkPad portfolio uses a fully-integrated client hardware and software solution from Lattice to deliver advanced user experiences including immersive engagement, privacy, and collaboration without sacrificing performance or battery life.

With the goal of providing a complete set of all the components required for RF energy harvesting, e-peas has added an antenna solution to its product portfolio. The antenna will complement the company’s series of energy-harvesting-dedicated power management ICs.

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2, and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the device enables secure connectivity for smart home, automotive, and industrial use cases, and supports the Matter connectivity protocol.

CEVA, Inc. announced that it has enhanced the software offerings and tool kits for its Bluebud wireless audio platform with the addition of Bluebud-HD, a pre-configured software package that includes all the audio, voice, and context-aware software required in premium TWS earbuds, gaming headsets, hearables, wearables, and other smart audio products.

LiFi (Light Fidelity) technology enables network connectivity using light. LiFi transmits data by modulating light signals from a light source, a process invisible to the naked eye. LiFi has a latency 100 times faster than WiFi.

Knowles Corporation announced the availability of the GM series receiver, a high-performance, two-way balanced armature receiver designed specifically to enable hearing health applications to deliver audiophile-quality music performance.

Working with researchers at Politecnico di Milano, CEA-Leti has developed the world's smallest-footprint MEMS gyroscope that is capable of providing navigation-grade performance. The researchers were able to meet these specifications with a sensor footprint of only 1.3 mm2 by leveraging nano-resistive sensing.

The BleuIO is a fully integrated solution that provides MCU and Bluetooth® radio in one chip, based on Dialog Semiconductor's latest Bluetooth chip, DA14683. The FLASH based device permits field or boot upgradable, while the application is stored on FLASH memory. Custom settings can also be stored on FLASH memory or OTP for higher integrity.