SEPA Europe introduced its HZ30B, an active chip cooler featuring an innovative method utilizing an integrated MF17B05 RaAxial mini fan housed within an aluminum pinbloc heat sink rather than being conventionally surface-mounted. The overall height of the HZ30B is 8mm and delivers a thermal resistance of 4.7 K/W.

Eschbach, Germany. Cooling down is a hot topic right now, and SEPA Europe decided to do something about it, at least for cooler chips. SEPA’s HXB100 chip cooler allows for chip cooling on multiple components with one fan, saving the cost and maintenance of having to add more. With mobile devices in mind, SEPA developed the HXB100 in a 100 g, 100 x 75 x 13 mm design.