SEPA's HZ30B Chip Cooler is Small, but Cool
February 29, 2024
News
SEPA Europe introduced its HZ30B, an active chip cooler featuring an innovative method utilizing an integrated MF17B05 RaAxial mini fan housed within an aluminum pinbloc heat sink rather than being conventionally surface-mounted. The overall height of the HZ30B is 8mm and delivers a thermal resistance of 4.7 K/W.
The chip cooler weighs 11 g and is ideal in environments where low-noise operation is desired. To simplify installation, the solution mounts without the need for drilling. Designed with a durable MagFix sleeve bearing, the MF17B05 is engineered to operate at temperatures up to 80°C, with a low power consumption of only 0.3 W at 5VDC.
According to SEPA, the HZ30B has a lifespan of 400000 hours and can be equipped with a tacho output for monitoring. SEPA will be showcasing the HZ30B at embedded world 2024.
For more information, visit sepa-europe.com.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
