Technology - Processing - Compute Modules

PICMG Enhances COM-HPC, IoT.x, MicroTCA Standards as Edge Computing Demands Peak

Chad Cox

August 29, 2022

Every industry influenced by technology is now demanding intelligence at the edge, often without understanding its implications. For most organizations, acquiring meaningful edge intelligence means drastically changing their IT and/or operational technology infrastructure to support the deployment, integration, and then management of vastly more electronic systems.

Processing - Compute Modules

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CWD Limited Releases a Semtech LoRa Connect Enhanced Dual Combo Module for IoT Cloud Devices

Chad Cox

October 6, 2022

Processing - Compute Modules

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2.5" PICO-ITX Board Powered by ARM

Chad Cox

October 6, 2022

Processing - Compute Modules

Image Provided by RDS

High-Resolution TFT Designed for HMI Applications

October 5, 2022

Renesas' New RTOS-Supported MPUs Enable High-Definition HMI and Fast Startup

Taryn Engmark

August 23, 2022

Compute Modules

AVerMedia Releases AGX Orin Box PC

Chad Cox

September 27, 2022

System on Modules or Chip-Down Design? It’s Complicated

Ohad Yaniv

September 23, 2022

NVIDIA Jetson Orin Nano System-On-Modules Advances Edge AI & Robotics Performance

Tiera Oliver

September 20, 2022

A Path Forward for the Resource-Constrained Edge Part 2

September 1, 2022

Fibocom Launches AI Smart Module SCA825-W

Tiera Oliver

August 22, 2022

Microchip Expands Its Portfolio of MPU-Based System-on-Modules (SOMs) with the SAM9X60D1G-SOM

Tiera Oliver

August 8, 2022

COMs Ease Concerns Related to Compatibility, Long-Life, Security, and More

WinSystems, Inc.

July 27, 2022

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Advantech Launches World’s First COM-HPC Module with AMD EPYCTM Embedded 7003 Server Processors

Chad Cox

July 13, 2022

Image Provided by congatec Inc.

7 New High Power and Passively Cooled CoMs from congatec

Chad Cox

June 28, 2022

Image Provided by congatec Inc.

Platforms for Functionally Safe Computing, Considering Mixed-Critical Applications

Chad Cox

June 28, 2022

Image Provided by Renesas Electronics Corporation

Renesas Creates Circuit Technologies for 22-nm Embedded STT-MRAM with Faster Read and Write Performance for IoT MCUs

Chad Cox

June 23, 2022

Image Courtesy of Fujitsu Components America

Wirepas Mesh 2.4 GHz Wireless Modules are now available from Fujitsu

Chad Cox

June 22, 2022

AVerMedia Introduces Next-Gen Industrial Solutions Powered by NVIDIA Jetson AGX Orin at Embedded World 2022

AVerMedia

June 20, 2022

Image Provided by congatec Inc.

congatec conga-HPC/sILH

Embedded Computing Design Staff

June 17, 2022

Image Provided by Connect Tech Inc.

Connect Tech Forge Carrier for NVIDIA® Jetson AGX Orin

Embedded Computing Design Staff

June 16, 2022

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AI-Blox Blox

Embedded Computing Design Staff

June 16, 2022

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Micro Crystal RV-3032-C7

Embedded Computing Design Staff

June 16, 2022

New Module From Grid Connect and RTA Gives Equipment Makers a ‘Universal Translator’ for Industrial Communications

Tiera Oliver

June 7, 2022

Sponsored

Product of the Week: WOLF Advanced Technology’s NVIDIA Orin-based 3U VPX SBC

Embedded Computing Design Staff

June 7, 2022

Modular Touch Computer Design Helps Create The Most Flexible Gas Monitoring System

DFI Inc.

May 31, 2022

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First In-House Designed Core from Ampere, the AmpereOne

Chad Cox

May 27, 2022

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NXP Eases Industrial IoT Development with its i.MX RT Industrial Drive Development Platform

Chad Cox

May 27, 2022

Forlinx has Launched OKMX6ULL-C SBC based on i.MX 6ULL

Tiera Oliver

May 27, 2022

Image Provided by Microchip Technologies

All in one: The First Microcontroller with Secure Subsystem and ARM TrustZone Technology

Chad Cox

May 27, 2022

Image Provided by Renesas Electronics Corporation

Renesas Will Demonstrate the First Working Silicon Based on the Recently Debuted Arm Cortex-M85 Processor

Renesas Electronics Corporation

May 26, 2022

Automotive

Image Courtesy of TE Connectivity

TE Connectivity’s PicoMQS Connector System Offers High Performance in a Compact Package

October 5, 2022

SEMI and AVCC Team to Promote Autonomous Vehicle Innovation and Mass Market Adoption
September 28, 2022
SiTime Expands New Precision Timing Solution for Autonomous Vehicles
September 28, 2022
TDK Offers Clip-On NTC Sensors for Heat Pumps in E-Mobility
September 28, 2022
NXP and Elektrobit Collaborate to Develop Software for Next-Generation Automotive Battery Management Systems
September 26, 2022

Healthcare

Digital Medical Surgery Tools Are Becoming Commonplace. Finding the Right Solutions Partner Is Key

September 27, 2022

Storage

Embedded Executive: Frank Chen, CEO, Exascend

September 14, 2022

Virtium StorFly SSDs Drop Power & Heat for Small Form Factor Industrial Environments
September 13, 2022
Product of the Week: Infineon Technologies’ SEMPER™ NOR Flash Memory
September 12, 2022
Product of the Week: Exascend's Industrial- and Enterprise-Grade PCIe Gen4 SSD
August 29, 2022
SEGGER’s Open BigFAT Specification Breaks FAT's 4GB Per File Barrier
August 29, 2022

Processing

Image Provided by CWD Limited

CWD Limited Releases a Semtech LoRa Connect Enhanced Dual Combo Module for IoT Cloud Devices

October 6, 2022

High-Resolution TFT Designed for HMI Applications
October 05, 2022
How 3D Printing Can Make Your Prototypes Easier
October 03, 2022
Could Remastering of Silicon be the Answer to the Global Chip Shortage?
October 03, 2022
Intel Launches 13th Gen Intel Core Processor Family
September 30, 2022