Technology - Processing - Compute Modules
Processing - Compute Modules
Toradex Launches OSM and Lino CoM Families Featuring NXP i.MX 93 and i.MX 91 Processors
December 5, 2025
Toradex introduced two new Computer on Module (CoM) families, OSM and Lino. The additions extend Toradex’s portfolio with modules leveraging NXP i.MX 93 and i.MX 91 processors including models OSM iMX93, OSM iMX91, Lino iMX93, and Lino iMX91.
Processing - Compute Modules
AAEON Launches COM-ARHC6 Featuring Intel Core Ultra Arrow Lake Processors
December 3, 2025
AAEON introduced its COM-ARHC6, a COM Express Type 6 Compact Size module (95mm x 95mm) leveraging the Intel Core Ultra Processors (Series 2) platform (formerly Arrow Lake) including the Intel Core Ultra 9 Processor 285H, Intel Core Ultra 7 Processor 255H, and Intel Core Ultra 5 Processor 225H offering up to 99 TOPs of AI performance.
Processing - Compute Modules
Hilscher Announces Secure Industrial Communication Module, the Multiprotocol comX 90
November 25, 2025
Hilscher announced its latest embedded module, the comX 90, designed for next-generation communication interfaces utilized in industrial devices. Within a compact form factor, the module combines multiprotocol communication, integrated security functions, and IIoT capability.
Compute Modules
Explore Critical Link’s MitySOM-A5E Agilex 5 FPGA Family at embedded world North America
October 22, 2025
Grinn Launches GenioSOM-700 and GenioSOM-510 Powered by MediaTek Genio Processors
September 19, 2025
New IBASE MBB1005 ATX Board Delivers AI Acceleration and Rugged Industrial Performance
July 11, 2025
Consumer
-
Arm Delivers Personal AI on Consumer Devices with New Lumex CSS Platform
September 10, 2025
-
TDK Announces High-Performance IMU to Accelerate Optical Image Stabilization Adoption
August 08, 2025
-
Application Highlight: Infineon Makes HMI the Main Event
August 04, 2025
-
Status Audio and Knowles Redefine Earbud Performance with Hybrid Driver Technology
July 15, 2025
Industrial
-
Dracula Technologies Debuts LAYER V2.0 OPV at CES 2026
January 05, 2026
-
Microelectronics US 2026 to Unite Semiconductor, Photonics, and Embedded Systems Leaders in Austin
December 22, 2025
-
intoPIX to Showcase Low-Power JPEG XS Image Processing Innovations at CES 2026
December 17, 2025
-
Cincoze MD-3000 DIN-Rail Computers Deliver Modular Expansion for Smart Manufacturing Systems
December 16, 2025
Security
-
Compliance with the EU Cyber Resilience Act: A Comprehensive Approach for OEMs
November 14, 2025
-
Embedded AI Security: How Embedded System Manufacturers Can Strengthen Protection with Secure Boot Key Management
November 13, 2025
-
Evergy Selects Kigen’s Secure eSIM OS and eIM to Boost Network Efficiency and Grid Stability
November 12, 2025
-
RunSafe Enhances its SBOM Generator Abilities with New Open-Source License Compliance Feature
November 11, 2025
HPC/Datacenters
-
A Comprehensive Digital Twin Environment and Semiconductor Lifecycle Management Can Ensure Reliable Data-Center Operations
November 24, 2025
-
The Power Problem Behind AI Data Center Performance
November 11, 2025
-
NODKA Leverages Intel Power for Industrial HPC Applications
November 06, 2025
-
Meeting the Demanding Energy Needs of AI Servers with Advanced Technology
October 23, 2025