Gumstix Adds Six Raspberry Development Boards

Rich Nass

November 11, 2020

COM-HPC - Next Generation Standard for Industrial Server Grade Computer-on-Modules

Tiera Oliver

November 10, 2020

Boardcon Released Allwinner H6 Platform for 4K HDR Set-Top Box

Tiera Oliver

November 9, 2020

Raspberry Pi Home Automation Part 2: Flash Devices With Tasmota Firmware

Jeremy S. Cook

November 6, 2020

AAEON Announces the ASDM-L-CFS Smart Display Module

Tiera Oliver

October 27, 2020

Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools

Tiera Oliver

October 26, 2020

Important Design Considerations for Electronic Devices - Part 3: Off the Shelf Solutions vs. Custom Hardware

Embedded Computing Design Staff

October 22, 2020

DEV KIT WEEKLY: Lattice Semiconductor CrossLink-NX Evaluation Board

Brandon Lewis

October 16, 2020

iWave Systems Selects u-blox's JODY-W2 Multiradio Module for its i.MX8 SOM, SBC Designs

u-blox

iWave Systems

October 16, 2020

InnoPhase Joins STMicroelectronics Partner Program

Perry Cohen

October 15, 2020

PICMG Ratifies MicroSAM - The New Microcontroller-Agnostic Module Form Factor for the Enablement of Smart Sensors

PICMG

October 13, 2020

Product of the Week: NVIDIA Jetson Nano 2 GB Developer Kit

NVIDIA

October 13, 2020

Eurotech Announces CPU-180-02, a SIL2-enabled module with the 11th Gen Intel? Core? processors

Eurotech

October 8, 2020

Eurotech Announces CPU-180-01, a COM-HPC module with the 11th Gen Intel Core processors

Eurotech

October 8, 2020

IBASE Rolls Out Slim-Type Fanless System with 8th Gen Intel? Core? Processors

IBASE

October 6, 2020

TQ Introduces New Intel Atom x6000E Based Computer-on-Module Product Family

Tiera Oliver

October 5, 2020

Software Considerations for Heterogeneous Arm Cores in Safety-Critical Applications

Green Hills Software

NXP Semiconductors

October 2, 2020

WINSYSTEMS Releases Three PC104 I/O Module Upgrades

Tiera Oliver

October 1, 2020

PCM-MIO-A-1, PCM-UIO48C-16 and PCM-UIO96C-16 modules incorporate latest technology and provide reliable performance in industrial -40C to +85C operating environments.

ADLINK Releases cExpress-TL, COM Express Type 6 Module

Perry Cohen

September 25, 2020

ADLINK released the cExpress-TL, its newest generation COM Express Type 6 module. The module is based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor.

SECO PRESENTS ITS FIRST COM-HPC MODULE WITH THE 11TH GENERATION INTEL CORE PROCESSORS

SECO

September 25, 2020

COM Express Type 6 and COM-HPC Client: Two great options

Christian Eder

September 24, 2020

Vecow Launched ECX-2200/2100 Rugged Expandable Embedded System

Vecow Co., Ltd

September 24, 2020

Featuring workstation-grade platform, system-oriented integration, flexible configurations and rugged reliability, ECX-2200/2100 expandable embedded system is ideal for Factory Automation

OnLogic Announces Partnership with AMD

Perry Cohen

September 22, 2020

OnLogic announced a partnership with AMD, allowing consumers access to a new line of industrial servers that are powered by the two company's processors, AMD Ryzen and AMD EPYC.

congatec Announces First COM-HPC and Next-Gen COM Express

Tiera Oliver

September 22, 2020

congatec fuels launch of 11th Gen Intel Core processors with two new design options