Kontron has New COM-HPC Mini Module in Development

By Chad Cox

Production Editor

Embedded Computing Design

November 17, 2023

News

Kontron has New COM-HPC Mini Module in Development
Image Credit: Kontron

Ismaning, Germany. Kontron is designing a COM-HPC Mini module centered on the COM-HPC 1.2 standard approved by PICMG. The COM-HPC Mini is marketed as having a generous enhancement in performance. New applications are possible by broader scalability while the module only measures 95 mm x 70 mm.

"COM-HPC Mini enables the integration of ultra-high-performance COMs in the smallest application areas. It is crucial that the technical possibilities of the Intel® Next Gen CoreTM platforms can be fully utilized," explains Irene Hahner, Product Manager COM-HPC Modules at Kontron.

Additional Features:

  • High-speed connector of 400 pins, including
    • 2 10 GbE interfaces
    • 16x PCIe (up to PCIe Gen5)
    • 4 USB 4 interfaces (Thunderbolt and DisplayPort Alternate Mode)

For more information, visit kontron.com/en.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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