The Road to embedded world: Join Trenz to Discover Next-Gen FPGA and Edge AI Hardware
March 03, 2026
Blog
Trenz will be bringing its lineup of brand-new hardware to embedded world Germany. At its booth, 5-140, Trenz will showcase ten new products (seven AMD-based and three Altera-based solutions) covering everything from budget friendly FPGA platforms and high-IO designs to RF signal processing and next-generation edge AI.
Booth Highlights:
TE0873
The key highlight is the TE0873, Trenz’s first module in its new AMD Spartan UltraScale+ series. The solution is designed for applications that demand deterministic performance, high data throughput, and flexible hardware acceleration, it is ideal for systems requiring many IOs.
With seamless integration and a compact form factor, the TE0873 combines on-board components such as QSPI flash, SDRAM, and USB-to-UART, supplemented by high-density board-to-board connectors making integration into custom carrier designs simpler.
AMD Platforms:
TE0825 - Zynq UltraScale+ for Industrial & Automotive:
- An embedded platform with automotive options, extensive IO resources, and 1000BASE-T1 Ethernet for connected controllers and gateway designs
TE0836 - Zynq UltraScale+ RFSoC:
- Built for broadband signal chains with integrated RF-ADCs/RF-DACs, DDR4 memory, and high-speed transceivers, ideal for SDR, test & measurement, and communications
TE0860 and TE0861 - Zynq UltraScale+ MPSoC SoMs:
- Two powerful SoMs featuring flexible DDR4 options (including ECC), eMMC, Gigabit Ethernet, USB, and multi-gigabit transceivers, designed for industrial embedded computing, vision, control, and interface bridging
TE0878 - Spartan UltraScale+ High-IO/High-Speed:
- Combines LPDDR5 with up to 8 GTH MGTs and extensive IO via board-to-board connectors, targeting compact, cost-efficient high-speed applications
TE0965 - Versal AI Edge Gen 2:
- Edge platform features LPDDR5 connectivity, various GTYP transceivers, and rich IO resources (including MIPI-ready capabilities), designed for Edge AI
Altera solutions: Agilex 3 and Agilex 5
TEI0135 - Altera Agilex 3 SoC:
- Features LPDDR4, eMMC, transceivers, MIPI D-PHY options, Ethernet, and TPM 2.0, for industrial embedded platforms
TEI0140 - Altera Agilex 3 (compact, prototyping-friendly):
- USB-C powered, integrated USB Blaster III (JTAG/UART/FIFO), and practical IO headers for fast evaluation and prototyping
TEI0186 - Altera Agilex 5 SoC:
- Developed for higher bandwidth and modern interfaces, supports up to 12 transceivers (up to 28 Gbit/s), LPDDR4, eMMC, MIPI D-PHY, and TPM 2.0, engineered for demanding embedded and communications systems
What to Expect:
Visitors can connect with other professionals that currently work with evaluating platforms for high-IO designs, RF signal processing, edge AI, or cost-optimized FPGAs. The Trenz experts will be available to help you compare the latest modules side by side, and discuss which solution best fits your next embedded, industrial, or communications design.
For more information, visit www.trenz-electronic.de.
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Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature.
