The Road to embedded world: Ceva to Bring Physical AI to Life
February 19, 2026
Blog
Visitors to Booth 4-462 at embedded world Germany will get to view demonstrations from Ceva showcasing its AI Fabric, a unified foundation of connectivity, sensing, and inference IP that powers intelligent, autonomous edge systems. The integrated architecture facilitates scalable, power-efficient Physical AI across consumer, industrial, automotive, and infrastructure applications.
Ceva’s AI Fabric:
Industry-Leading Performance
- Ultra-reliable, low-latency connectivity, optimized DSP, and sensor fusion for clean, efficient signal processing
- Scalable NPUs for high-performance inference at ultra-low power
Seamless Integration
- Ceva IP is designed to fit effortlessly into your architecture
Flexibility
- Choose and combine IP blocks to meet your unique design requirements
For more information, visit https://www.ceva-ip.com/physical-ai/.
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Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature.
