The Road to embedded world: Ceva to Bring Physical AI to Life

By Chad Cox

Production Editor

Embedded Computing Design

February 19, 2026

Blog

Image Credit: Ceva

Visitors to Booth 4-462 at embedded world Germany will get to view demonstrations from Ceva showcasing its AI Fabric, a unified foundation of connectivity, sensing, and inference IP that powers intelligent, autonomous edge systems. The integrated architecture facilitates scalable, power-efficient Physical AI across consumer, industrial, automotive, and infrastructure applications.

Ceva’s AI Fabric:

Industry-Leading Performance

  • Ultra-reliable, low-latency connectivity, optimized DSP, and sensor fusion for clean, efficient signal processing
  • Scalable NPUs for high-performance inference at ultra-low power

Seamless Integration

  • Ceva IP is designed to fit effortlessly into your architecture

Flexibility

  • Choose and combine IP blocks to meet your unique design requirements

For more information, visit https://www.ceva-ip.com/physical-ai/.

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Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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