Cool Your Chips with SEPA’s HXB100
July 27, 2023
News
Eschbach, Germany. Cooling down is a hot topic right now, and SEPA Europe decided to do something about it, at least for cooler chips. SEPA’s HXB100 chip cooler allows for chip cooling on multiple components with one fan, saving the cost and maintenance of having to add more. With mobile devices in mind, SEPA developed the HXB100 in a 100 g, 100 x 75 x 13 mm design.
For fail-safe cooling, durable ball bearings are utilized creating a maturity of 350.000 h (MTBF at 40°C). The design boasts an aluminum heatsink and a black oxide coating leading to the increase of heat output. SEPA’s HXB100 comes with a milled underside extending the fanned area in user’s applications.
SEPA offers pre-assembled HXB100 chip coolers for a safe and easy connection. The solution ommits the need for solder connections or spring clips when installing into a system.
For more information, visit sepa-europe.com/en.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
